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Thermal annealing behaviour of Pt on n-GaN Schottky contacts

机译:Pt在n-GaN肖特基接触上的热退火行为

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The structural evolution and temperature dependence of the Schottky barrier heights of Pt contacts on n-GaN epilayer at various annealing temperatures were investigated extensively by Rutherford backscattering spectrometry, x-ray diffraction measurements, Auger electron spectroscopy, scanning electron microscopy and current-voltage measurements. The temperature dependence of the Schottky barrier heights may be attributed to changes of surface morphology of Pt films on the surface and variation of nonstoichiometric defects at the interface vicinity. Experimental results indicated the degradation of Pt contacts on n-GaN above 600 degreesC. [References: 17]
机译:通过卢瑟福背散射光谱,X射线衍射测量,俄歇电子能谱,扫描电子显微镜和电流电压测量,广泛研究了在不同退火温度下n-GaN外延层上Pt触点的肖特基势垒高度的结构演变和温度依赖性。肖特基势垒高度的温度依赖性可能归因于表面Pt膜表面形态的变化以及界面附近非化学计量缺陷的变化。实验结果表明,高于600摄氏度时,n-GaN上的Pt触点退化。 [参考:17]

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