Effect of Maleimide Compounds on Pattern-forming Property of Photosensitive Polyimide Based on Negative-tone Reaction Development Patterning

摘要

Photosensitive polymers have been used to various applications, such as photoresists for patterning of integrated circuits (ICs), buffer coat layers for IC chips, interlayer dielectric films, and manufacturing of printing plates, color filters, and optical waveguides [1,2]. Such the applications require appropriate design of each photosensitive polymer. In electronics packaging (Jisso) like buffer coat layers and interlayer dielectrics, high thermal, mechanical and insulating properties are needed to photosensitive polymers due to permanent utilization of the prepared patterns,