Photosensitive polymers have been widely used in various industries, such as photoresists for patterning of integrated circuits (ICs), buffer coat layers for IC chips and interlayer dielectric films in electronics industry, and manufacturing of printing plates, color filters, optical waveguides.1'2 Different properties are required for such the applications of photosensitive polymers, and the most appropriate molecular designs should be adopted for each application. In electronics packaging (Jisso) like buffer coat layers and interlayer dielectrics, though requirement for resolution is not strict, high thermal, mechanical and insulating properties are required for photosensitive polymers because of permanent utilization of patterns without removing. Therefore, photosensitive polymers based on engineering plastics, known as high-performance polymers, have been studied, and especially, photosensitive polyimides have received extensive attentions because of their excellent properties.3 Conventional photosensitive polyimides have utilized derivatives of polyimide precursor, poly(amic acid), or functionalized polyimides as polymer components.4"8 However, preparation of these polymers often requires complicated and high-cost synthetic routes. In addition, high temperature post-curing is needed for imide ring formation when poly(amic acid) derivatives are used as the polymer components.
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