Effect of Maleimide Compounds on Pattern-forming Property of Photosensitive Polyimide Based on Negative-tone Reaction Development Patterning

摘要

Photosensitive polymers have been used tovarious applications，SuCh as photoresists fbrPattemingofintegratedcircuits（ICs），bufEbrcoatlayersforICchips，lnterlayerdielectricmms，andmanufacturlngOfprintlngPlates，COlormters，andopticalwaveguides［1，2］?Such the applicationsrequlreaPPrOPrlatedeslgnOfeachphotosensitivepolymer．In electronics packaging（カsso）likebu脆rcoatlayers andinterlayerdielectrics，highthermal，meChanicalandinsulatlngPrOPerties areneeded to photosensitive polymers due toPermanent utilization of the prepared pattemS，though their requlred resolutionis micrometerrange?Therefore，for such uses，addition ofPhotosensitivlty tO POlyimides has been studiedbecauseoftheirexcellentthermal，meChanicalandinsulation properties［3］．Conventionalstrategiesfor photosensitive polyimides are utilization ofPOlyimide pfeCurSOr，POly（amic acid），and／orfunctionalizatlOn Of polyimide struCturel4－8］?However，these molecular deslgnSlead toCOmPlicated and high－COSt Synthetic routes?Inaddition，high temperature post－CurlnglS neededforimideringformationwhenpoly（amicacid）sareusedasthepolymercomponent?