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Mechanism of forming defects in roll-to-roll hot embossing of micro-pyramid arrays: II. Numerical study

机译:在微金字塔阵列的卷对卷热压花中形成缺陷的机理:II。数值研究

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Roll-to-roll (R2R) hot embossing is a continuous imprinting technique for the replication of large-area microstructures. Polymer deformation and recovery behavior is more complicated in this process than in the traditional plate-to-plate mode, especially for the embossing of 3-dimensional (3D) structures, such as the micro-pyramid structure used for reflective film. As a result, forming defects of poor shape and dimensional accuracy are more likely to emerge and are of greater diversity, which may negatively influence product quality and must be eliminated. In our previous experimental study, we have defined several types of forming defects that are commonly seen in embossed micro-pyramid arrays and have discussed the influence of processing parameters on the forming defects systematically. What is presented in this article is devoted to the simulation analysis of the forming mechanism of three typical types of forming defect: the platform-like defect, the bubble-like defect and the collapse-like defect. A 3D finite element model is established for the simulation analysis, in which the polymer resist is treated as a viscoelastic material based on the general Maxwell model. The simulation results clearly reveal the correlation between the forming defects and the processing conditions, indicating that the platform-like defect and the bubble-like defect are caused by material transport problems while the collapse-like defect results from polymer recovery. The underlying mechanisms for the forming defects disclosed in this research can provide effective guidelines for better process control as well as for improved design of the R2R hot embossing system.
机译:卷对卷(R2R)热压印是用于复制大面积微结构的连续压印技术。与传统的板对板模式相比,此过程中的聚合物变形和恢复行为更为复杂,尤其是对于3维(3D)结构的压印,例如用于反射膜的微金字塔结构。结果,形状和尺寸精度差的成形缺陷更容易出现并且具有更大的多样性,这可能会对产品质量产生负面影响,必须予以消除。在我们之前的实验研究中,我们定义了几种类型的成型缺陷,这些类型的缺陷通常在压纹微金字塔阵列中见到,并且系统地讨论了加工参数对成型缺陷的影响。本文介绍了三种典型类型的成形缺陷的形成机理的模拟分析:平台状缺陷,气泡状缺陷和塌陷状缺陷。建立了用于仿真分析的3D有限元模型,其中基于通用的麦克斯韦模型将聚合物抗蚀剂视为粘弹性材料。仿真结果清楚地揭示了成形缺陷与加工条件之间的相关性,表明平台状缺陷和气泡状缺陷是由材料传输问题引起的,而塌陷状缺陷则是由聚合物回收导致的​​。本研究中揭示的形成缺陷的潜在机制可以为更好的过程控制以及R2R热压花系统的改进设计提供有效的指导。

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