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首页> 外文期刊>Journal of Low Power Electronics >Optimization of On-Chip Interconnect Signaling for Low Energy and High Performance
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Optimization of On-Chip Interconnect Signaling for Low Energy and High Performance

机译:针对低功耗和高性能的片上互连信号的优化

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摘要

Coupling capacitance between adjacent wires in the on-chip interconnects significantly increases the average transition energy dissipation, and the maximum delay. This paper proposes an encoding scheme to, further, reduce the coupling energy dissipation, delay and energy delay product. Specifically, for 65 nm CMOS technology, we present an 8-bit to 10-bit equivalent solution that reduces the energy dissipation by 55%, delay by 24% and energy delay product by 55%, without any additional area penalty, while requiring a less complex circuit overhead when compared with the transition pattern coding (TPC) scheme. Further, we apply this scheme, to a 16-bit bus with due consideration given to the energy loss at the interfaces.
机译:片上互连中相邻导线之间的耦合电容会显着增加平均过渡能量耗散和最大延迟。本文提出了一种编码方案,以进一步减少耦合能量耗散,延迟和能量延迟乘积。具体来说,对于65 nm CMOS技术,我们提出了一种8位至10位等效解决方案,该解决方案将能耗降低了55%,延迟降低了24%,能量延迟乘积降低了55%,而没有任何额外的面积损失,同时要求与过渡模式编码(TPC)方案相比,电路开销较小。此外,我们将这种方案应用于16位总线,同时充分考虑了接口处的能量损耗。

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