Interaction forces between oxide and silica-modified terpolymerabrasives and their impact on CMP and post-CMP

摘要

As microelectronic device features continue shrinking and new challenging materials areintroduced, Chemical Mechanical Planarization (CMP) and post-CMP issues become increasinglychallenging. Our work focuses on reducing CMP induced defectivity using new types of additive-free composite abrasive comprising polymer particles coated with silica. The composites areachieved by either creating chemical bonds using silane coupling agents or tuning the pH in order toform electrostatic attractive interactions between the core and the shell [1]. Better control of theabrasive behavior in the CMP process demands a detailed understanding of the role played by eachof the main parameters, such as their mechanical and surface properties, and the interrelationbetween them.