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Interaction forces between oxide and silica-modified terpolymer abrasives and their impact on CMP and post-CMP

机译:氧化物和二氧化硅改性三元共聚物研磨剂之间的相互作用力及其对CMP和CMP后的影响

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Colloidal AFM was used to perform adhesion force measurements between a silica surface and polymer and silica-modified composite abrasives in DIW and buffer solutions at pH 4 and 10. We found that the pull-off forces for all the particles increase with decreasing pH. This effect is more evident in the case of the polymer colloids that are positively charged for pH below neutrality due to the presence of surface amino groups. The post-CMP particle removal efficiency after brush scrubbing in dilute ammonia is lower for the polymer particles. The relative density of the polymer particles on the oxide surface after CMP decreases with increasing pH. Furthermore, in the buffer solution at pH 10 we observe the highest RR due to the higher dissolution rate of the silica in alkaline pH.
机译:胶体AFM用于在pH 4和10处在DIW和缓冲溶液中进行二氧化硅表面和聚合物和二氧化硅改性的复合物研磨剂之间的粘附力测量,并在pH 4和10中发现所有颗粒的拉出力随着pH的降低而增加。在聚合物胶体的情况下,这种效果更明显,该聚合物胶体由于表面氨基存在下低于中性的pH值。在稀氨中擦洗后CMP颗粒去除效率较低,用于聚合物颗粒。 CMP在CMP随着pH值下降后氧化物表面上的聚合物颗粒对氧化物表面的相对密度。此外,在pH10的缓冲溶液中,由于碱性pH中的二氧化硅的较高溶解速率,我们观察到最高的RR。

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