Interaction forces between oxide and silica-modified terpolymer abrasives and their impact on CMP and post-CMP

摘要

As microelectronic device features continue shrinking and new challenging materials are introduced, Chemical Mechanical Planarization (CMP) and post-CMP issues become increasingly challenging. Our work focuses on reducing CMP induced defectivity using new types of additive-free composite abrasive comprising polymer particles coated with silica. The composites are achieved by either creating chemical bonds using silane coupling agents or tuning the pH in order to form electrostatic attractive interactions between the core and the shell [1], Better control of the abrasive behavior in the CMP process demands a detailed understanding of the role played b"> each of the main parameters, such as their mechanical and surface properties, and the interrifiation between them.