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Neutron Radiation Effects in Epitaxially Laterally Overgrown GaN Films

机译:外延横向生长的GaN薄膜中的中子辐射效应

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Neutron radiation effects were studied in undoped n-GaN films grown byepitaxial lateral overgrowth (ELOG). The irradiation leads to carrier removal and introduces deep electron traps with activation energy 0.8 eV and 1 eV. After the application of doses exceeding 10~(17) cm~(-2), the material becomes semi-insulating n-type, with the Fermi level pinned near the level of the deeper electron trap. These features are similar to those previously observed for neutron irradiated undoped n-GaN prepared by standard metal-organic chemical vapor deposition (MOCVD). However, the average carrier removal rate and the deep center introduction rate in ELOG samples is about five-times lower than in MOCVD samples. Studies of electron beam induced current (EBIC) show that the changes in the concentration of charged centers are a minimum in the low-dislocation-density laterally overgrown regions and radiation-induced damage propagates inside these laterally overgrown areas from their boundary with the high-dislocation-density GaN in the windows of the ELOG mask.
机译:在通过外延横向过生长(ELOG)生长的未掺杂n-GaN薄膜中研究了中子辐射效应。辐射导致载流子去除,并引入深电子陷阱,其激活能为0.8 eV和1 eV。施加超过10〜(17)cm〜(-2)的剂量后,材料变成半绝缘的n型,费米能级固定在较深电子陷阱的能级附近。这些特征与以前通过标准金属有机化学气相沉积(MOCVD)制得的中子辐照的未掺杂n-GaN相似。但是,ELOG样品中的平均载流子去除率和深中心引入率比MOCVD样品低约五倍。对电子束感应电流(EBIC)的研究表明,在低位错密度的横向过度生长区域中,带电中心的浓度变化最小,并且辐射诱发的损伤从其横向高生长区域的边界向高辐射方向扩展。 ELOG掩模窗口中的位错密度GaN。

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