Investigation of a new lead free solder alloy using thin strip specimens

摘要

The thermomechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep, and fatigue, are carried out on a computer controlled 6-axis mini-fatigue tester. The thinstrip specimen is used in this research, which is specially designed and verified to be suitable for the testing of solder alloys and comparable to the data from the literature. Based on the experimental study, the new lead free solder alloy shows veryattractive characteristics and may have potential applications in electronics packaging products.