首页> 外国专利> Production manner of the lead free solder alloy and the lead free solder alloy, the implemental structure, implemental manner, production manner of the lead free fuse alloy and the lead free fuse alloy, the tabular fuse, Al 0.08 mass or less of 0.02 mass or more being added in

Production manner of the lead free solder alloy and the lead free solder alloy, the implemental structure, implemental manner, production manner of the lead free fuse alloy and the lead free fuse alloy, the tabular fuse, Al 0.08 mass or less of 0.02 mass or more being added in

机译:无铅焊料合金和无铅焊料合金的生产方式,无铅熔断器合金和无铅熔断器合金,板状熔断器的实施结构,实施方式,生产方式,0.02质量%以下的Al为0.08质量%以下已添加%或更多

摘要

PROBLEM TO BE SOLVED: To provide lead-free solder alloy having a hypoeutectic composition with Sn as a base material in which coarse structure of primary crystal -Sn phase is refined, the hardness of the primary crystal -Sn phase is increased substantially as high as that of the eutectic phase, and the thermal fatigue characteristic together with the mechanical characteristic is improved by unifying the characteristics including the hardness of the structure.;SOLUTION: In the lead-free solder alloy, 0.01% and 0.1% Al, by weight, is added to the alloy of hypo-eutectic composition containing metal of one metal selected from a group consisting of Ag, In, Cu, Zn and Bi with Sn as a base metal. The lead-free solder alloy contains by weight 0.5% and 3% Ag, 1% and 8% In, 0.1% and 0.5% Cu, 1% and 5% Zn, and 1% Bi and 10% Bi.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:要解决的问题:为了提供具有以Sn为基体的亚共晶组成的无铅焊料合金,其中细化了初晶-Sn相的粗组织,初晶-Sn相的硬度大大提高了。通过统一包括结构硬度在内的特性,可改善共晶相的热疲劳特性以及机械特性;解决方案:无铅焊料合金中的Al按重量计为0.01%和<0.1%将Al 2 O 3加入到亚共晶组成的合金中,该合金含有一种金属,该金属选自Ag,In,Cu,Zn和Bi,其中Sn为贱金属。无铅焊料合金包含0.5%和<3%的Ag,1%和8%的In,0.1%和0.5%的Cu,1%和5%的Zn和1%Bi和10%的Bi。 (C)2005,日本特许厅

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