机译:电子产品中使用的无铅微合金化低银焊料合金上电化学形成的树枝状晶体的微观结构和元素组成
Department of Electronics Technology, Budapest University of Technology and Economics, Egry Jozsef utca 18., Building V1, Ground floor, Budapest H-1111, Hungary;
Materials Corrosion Group, National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan;
Department of Electronics Technology, Budapest University of Technology and Economics, Egry Jozsef utca 18., Building V1, Ground floor, Budapest H-1111, Hungary;
Materials Corrosion Group, National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan;
Materials Corrosion Group, National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan;
Department of Electronics Technology, Budapest University of Technology and Economics, Egry Jozsef utca 18., Building V1, Ground floor, Budapest H-1111, Hungary;
Department of Electronics Technology, Budapest University of Technology and Economics, Egry Jozsef utca 18., Building V1, Ground floor, Budapest H-1111, Hungary;
A. Alloy; B. STEM; C. Anodic dissolution; C. Pourbaix diagram;
机译:微结构阵列影响无铅SnAg焊料合金的电化学行为
机译:Sn-Bi无铅焊料的电沉积:复合剂对成分,附着力和枝晶形成的影响
机译:热老化对无铅焊料合金(SAC387)在电子器件中使用的微观结构,蠕变和腐蚀行为的影响
机译:低Ag无铅焊料合金的电化学迁移研究
机译:微合金化对Sn-Ag-Cu无铅焊料组织演变的影响。
机译:电子包装中的Sn-Cu无铅焊料的结构和性能
机译:电子包装中低温无铅焊料的微观结构和性能综述
机译:基于agsn的焊料合金和无铅电子器件中的焊料/导体相互作用