LEAD-FREE SOLDER ALLOY, METHOD FOR MANUFACTURING THE SAME, MOUNTING STRUCTURAL BODY, MOUNTING METHOD, LEAD-FREE FUSE ALLOY, METHOD FOR MANUFACTURING THE SAME, PLATE FUSE, LEAD-FREE ALLOY, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide lead-free solder alloy having a hypoeutectic composition with Sn as a base material in which coarse structure of primary crystal -Sn phase is refined, the hardness of the primary crystal -Sn phase is increased substantially as high as that of the eutectic phase, and the thermal fatigue characteristic together with the mechanical characteristic is improved by unifying the characteristics including the hardness of the structure.;SOLUTION: In the lead-free solder alloy, 0.01% and 0.1% Al, by weight, is added to the alloy of hypo-eutectic composition containing metal of one metal selected from a group consisting of Ag, In, Cu, Zn and Bi with Sn as a base metal. The lead-free solder alloy contains by weight 0.5% and 3% Ag, 1% and 8% In, 0.1% and 0.5% Cu, 1% and 5% Zn, and 1% Bi and 10% Bi.;COPYRIGHT: (C)2005,JPO&NCIPI