COMPOSITION FOR HIGH MELTING POINT LEAD-FREE SOLDER, METHOD FOR MANUFACTURING HIGH MELTING POINT LEAD-FREE SOLDER ALLOY, AND UTILIZATION METHOD THEREOF

摘要

The present invention relates to a high melting point lead-free solder capable of soldering high melting point electronic components without lead (Pb) which is harmful to human bodies and, more specifically, to a composition for a high melting point lead-free solder containing bismuth (Bi), silver (Ag) copper (Cu), and antimony (Sb), a high melting point solder alloy, and an utilization method thereof. The present invention is environmentally friendly by forming the composition for a solder of a quaternary alloy comprising bismuth (Bi), silver (Ag), copper (Cu), and antimony (Sb). Also, the present invention can obtain good bonding strength by improving wettability and mechanical strength; thereby drastically enhancing the workability and reliability of soldering.;COPYRIGHT KIPO 2015