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Preparation of diamond whiskers using Ar/O_2 plasma etching

机译:使用Ar / O_2等离子体蚀刻制备金刚石晶须

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Radio frequency (RF) plasma etching of chemical vapor deposition (CVD) diamond film has been investigated in Ar/O_2 plasmas, with an emphasis to elucidate the effects of reacting gas on the fabrication of diamond whiskers. Diamond whiskers were formed on diamond films pre-coated with Al. It was found that diamond whiskers preferentially formed at the diamond grain boundaries. The densities of diamond whiskers increased with O_2/Ar ratio. Whiskers obtained in pure O_2 plasma etching were 50 nm in diameter and 1 mu m in height. The etching rate was increased by mixing Ar with appropriate volume of O_2. Al coated on the diamond surface reacted with O_2 to form Al_2O_3, serving as mask to restrain the etching underneath. Raman spectroscopy measurement confirmed that the whiskers kept sp~3 diamond bonding structure after RF plasma etching. The field emission characteristics of the whiskers were also inspected.
机译:已经在Ar / O_2等离子体中研究了化学气相沉积(CVD)金刚石薄膜的射频(RF)等离子体蚀刻,重点在于阐明反应气体对金刚石晶须制造的影响。金刚石晶须形成在预涂有Al的金刚石膜上。发现金刚石晶须优先在金刚石晶粒边界处形成。金刚石晶须的密度随O_2 / Ar比的增加而增加。通过纯O_2等离子体蚀刻获得的晶须直径为50 nm,高度为1μm。通过将Ar与适当体积的O_2混合来提高蚀刻速率。涂覆在金刚石表面上的Al与O_2反应形成Al_2O_3,用作限制其下方蚀刻的掩模。拉曼光谱测量证实,晶须在RF等离子刻蚀后保持sp〜3金刚石键结构。还检查了晶须的场发射特性。

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