首页> 外文期刊>Surface and Interface Analysis: SIA: An International Journal Devoted to the Development and Application of Techniques for the Analysis of Surfaces, Interfaces and Thin Films >The effects of a combined thermal treatment of substrate heating and post-annealing on the microstructure of InGaZnO films and the device performance of their thin film transistors
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The effects of a combined thermal treatment of substrate heating and post-annealing on the microstructure of InGaZnO films and the device performance of their thin film transistors

机译:加热和后退火相结合的热处理对InGaZnO薄膜微观结构及其薄膜晶体管器件性能的影响

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摘要

This study examined the possibility of engineering the microstructure of InGaZnO films and enhancing the device performance of their thin film transistors by combining the thermal treatments of substrate heating and post-annealing. Microstructure characterization using high-resolution transmission electron microscopy and energy-filtered selected area electron diffraction helped us to unravel a systematic improvement in atomic order induced by substrate heating. Hall measurement analysis confirmed that the electrical properties(carrier concentration and electron mobility)varied very sensitively with the thermal treatments. The combined thermal treatments were found to effectively enhance the overall device performance of the transistors, and the sample deposited at 200 °C and post-annealed at 400 °C showed the best transistor characteristics with a saturation mobility(μ_(sat))of nearly 26 cm~2/V s.
机译:这项研究研究了通过结合衬底加热和后退火处理来设计InGaZnO薄膜微结构并增强其薄膜晶体管的器件性能的可能性。使用高分辨率透射电子显微镜和能量过滤选定区域电子衍射进行的微结构表征帮助我们揭示了由基板加热引起的原子序的系统性改进。霍尔测量分析证实,电性能(载流子浓度和电子迁移率)随热处理的变化非常敏感。发现组合的热处理可以有效地增强晶体管的整体器件性能,在200°C沉积并在400°C后退火的样品显示出最佳的晶体管特性,其饱和迁移率(μ_(sat))接近于26厘米〜2 / V s。

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