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An Analytical Model for Soft Error Critical Charge of Nanometric SRAMs

机译:纳米SRAM软错误临界电荷的解析模型。

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摘要

Scaling transistor size to the scale of the nanometer coupled with reduction of supply voltage has made SRAMs more vulnerable to soft errors than ever before. The vulnerability has been accentuated by increased variability in device parameters. In this paper, we present an analytical model for critical charge in order to assess the soft error vulnerability of 6T SRAM cell. The model takes into account the dynamic behavior of the cell and demonstrates a simple technique to decouple the nonlinearly coupled storage nodes. Decoupling of storage nodes enables solving associated current equations to determine the critical charge for an exponential noise current. The critical charge model thus developed consists of both NMOS and PMOS transistor parameters. Consequently, the model can estimate critical charge variations due to variability of transistor parameters and manufacturing defects, such as resistive contacts and vias. In addition, the model can serve as a tool to optimize the hibernation voltage of low-power SRAMs or the size of MIM capacitor per cell in order to achieve a target soft error robustness. Critical charge calculated by the model is in good agreement with SPICE simulations for a commercial 90-nm CMOS process with a maximum discrepancy of less than 5%.
机译:将晶体管的尺寸缩放到纳米级,再加上电源电压的降低,使得SRAM比以往任何时候都更容易受到软错误的影响。设备参数可变性的增加加剧了该漏洞。在本文中,我们提出了一种临界电荷分析模型,以评估6T SRAM单元的软错误脆弱性。该模型考虑了单元的动态行为,并演示了一种将非线性耦合的存储节点解耦的简单技术。存储节点的去耦能够求解关联的电流方程式,以确定指数噪声电流的临界电荷。这样开发的临界电荷模型包括NMOS和PMOS晶体管参数。因此,该模型可以估计由于晶体管参数和制造缺陷(例如电阻性接触和过孔)的变化而导致的临界电荷变化。此外,该模型还可以用作优化低功耗SRAM的休眠电压或每个单元的MIM电容器尺寸的工具,以实现目标软错误鲁棒性。该模型计算出的临界电荷与SPICE模拟非常吻合,后者的商业90nm CMOS工艺最大差异小于5%。

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