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Tunnel FETs for Ultra-Low Voltage Digital VLSI Circuits: Part II–Evaluation at Circuit Level and Design Perspectives

机译:用于超低压数字VLSI电路的隧道FET:第二部分–电路级评估和设计角度

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摘要

In Part II of this paper, the potential of tunnel FETs (TFETs) for ultra-low voltage (ULV)/ultra-low power (ULP) operation at 32-nm node is investigated through Verilog-A simulations of appropriate reference circuits. Critical issues arising at ultra-low voltages are analyzed, including static robustness of TFET logic gates, performance degradation, and sensitivity to process variations. Guidelines to design ultra-low energy standard cell libraries are derived. The minimum energy point is analyzed in a wide range of conditions, and guidelines for microarchitectural optimization for ultra-low energy are introduced. Voltage scalability of static RAM memories is also analyzed as main limitation to aggressive voltage scaling of very large scale integration (VLSI) systems, and improved precharge schemes are introduced to reduce leakage. The impact of variations of the main device parameters on VLSI digital circuits is investigated to identify the most critical variations that need to be controlled at process level. This investigation permits to understand the potential of TFETs and their advantages over traditional devices within a unitary framework that is based on fair design and comparison from device to circuit level, as well as to develop clear design perspectives in the context of ULV/ULP VLSI digital circuits.
机译:在本文的第二部分中,通过适当参考电路的Verilog-A仿真研究了隧道FET(TFET)在32 nm节点上超低电压(ULV)/超低功率(ULP)操作的潜力。分析了在超低电压下产生的关键问题,包括TFET逻辑门的静态鲁棒性,性能下降以及对工艺变化的敏感性。得出了设计超低能耗标准细胞库的指南。在广泛的条件下分析了最低能量点,并介绍了用于超低能量的微体系结构优化的指南。静态RAM存储器的电压可扩展性也被分析为超大规模集成(VLSI)系统的主动电压缩放的主要限制,并且引入了改进的预充电方案以减少泄漏。研究了主要器件参数的变化对VLSI数字电路的影响,以识别需要在过程级进行控制的最关键的变化。这项研究可以在一个统一的框架内了解TFET的潜力及其相对于传统器件的优势,该框架基于公平的设计和从器件到电路级的比较,并且可以在ULV / ULP VLSI数字化背景下提出清晰的设计观点电路。

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