首页> 外文期刊>Superlattices and microstructures >Impact of gate length and barrier thickness on performance of InP/InGaAs based Double Gate Metal-Oxide-Semiconductor Heterostructure Field-Effect Transistor (DG MOS-HFET)
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Impact of gate length and barrier thickness on performance of InP/InGaAs based Double Gate Metal-Oxide-Semiconductor Heterostructure Field-Effect Transistor (DG MOS-HFET)

机译:栅极长度和势垒厚度对基于InP / InGaAs的双栅极金属氧化物半导体异质结构场效应晶体管(DG MOS-HFET)性能的影响

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摘要

In this paper, we have analyzed the performance of InP/InGaAs heterostructure Double Gate MOSFET for variation of gate length (L_g) and barrier thickness (tb), using 2D sentaurus TCAD simulation. Drift-diffusion model was taken for simulating the proposed device. The gate length was varied from 12 nm to 30 nm and barrier thickness was changed from 1 nm to 3 nm. As gate length is reduced for scaling, higher drain current is achieved but at the expense of degraded DIBL and SS, furthermore, threshold voltage, I_(on)/I_(off). intrinsic delay and energy delay product are reduced. As barrier thickness is increased, there is an increase in DIBL, SS, intrinsic delay, energy delay product, while threshold voltage and I_(on)/I_(off) decrease. Except SS and I_(on)/I_(off) all other parameters are acceptable, a needful to improve the two parameters. However, the proposed device is ultimate to replace the MOSFETS for high speed application in the future.
机译:在本文中,我们使用二维传感器TCAD仿真分析了InP / InGaAs异质结构双栅极MOSFET在栅极长度(L_g)和势垒厚度(tb)变化方面的性能。采用漂移扩散模型来模拟所提出的装置。栅极长度从12 nm更改为30 nm,势垒厚度从1 nm更改为3 nm。随着栅极长度的减小以进行缩放,可以获得更高的漏极电流,但以降低的DIBL和SS为代价,此外,阈值电压为I_(on)/ I_(off)。减少了固有延迟和能量延迟乘积。随着势垒厚度的增加,DIBL,SS,固有延迟,能量延迟乘积增加,而阈值电压和I_(on)/ I_(off)减小。除SS和I_(on)/ I_(off)外,其他所有参数都是可以接受的,这是改进这两个参数的必要条件。然而,所提出的器件最终将替代未来用于高速应用的MOSFET。

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  • 来源
    《Superlattices and microstructures》 |2013年第3期|8-15|共8页
  • 作者单位

    Nano Device Simulation Laboratory. Electronics and Telecommunication Engineering Department, Jadavpur University, Kolkata 700 032, India;

    Nano Device Simulation Laboratory. Electronics and Telecommunication Engineering Department, Jadavpur University, Kolkata 700 032, India;

    Nano Device Simulation Laboratory. Electronics and Telecommunication Engineering Department, Jadavpur University, Kolkata 700 032, India;

    SKP College of Engineering, Tiruvannamalai, Tamilnadu 606 61I, India;

    Nano Device Simulation Laboratory. Electronics and Telecommunication Engineering Department, Jadavpur University, Kolkata 700 032, India;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    DGMOSFET; short channel effect; heterostructure; TCAD; drift-diffusion;

    机译:DGMOSFET;短通道效应;异质结构TCAD;漂移扩散;

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