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Investigation of 6T SRAM memory circuit using high-k dielectrics based nano scale junctionless transistor

机译:基于高介电常数纳米级无结晶体管的6T SRAM存储电路研究

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In this paper the Dual Metal Surround Gate Junctionless Transistor (DMSGJLT) has been implemented with various high-k dielectric. The leakage current in the device is analysed in detail by obtaining the band structure for different high-k dielectric material. It is noticed that with increasing dielectric constant the device provides more resistance for the direct tunnelling of electron in off state. The gate oxide capacitance also shows 0.1 µF improvement with Hafnium Oxide (Hfo_2) than Silicon Oxide (S1O_2). This paved the way for a better memory application when high-k dielectric is used. The Six Transistor (6T) Static Random Access Memory (SRAM) circuit implemented shows 41.4% improvement in read noise margin for HfO_2 than S1O_2. It also shows 37.49% improvement in write noise margin and 30.16% improvement in hold noise margin for HfO_2 than S1O2.
机译:本文采用多种高k电介质实现了双金属环绕栅无结晶体管(DMSGJLT)。通过获得不同高k介电材料的能带结构来详细分析器件中的泄漏电流。注意到随着介电常数的增加,该器件为处于截止状态的电子的直接隧穿提供了更大的电阻。氧化Ha(Hfo_2)的栅极氧化物电容也比氧化硅(S1O_2)提高0.1 µF。当使用高k电介质时,这为更好的存储应用铺平了道路。实施的六晶体管(6T)静态随机存取存储器(SRAM)电路显示,HfO_2的读取噪声容限比S1O_2改善了41.4%。与S1O2相比,HfO_2的写入噪声容限提高了37.49%,保持噪声容限提高了30.16%。

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