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Wafer Drying in Wet Processing: The Challenge of the Future

机译:湿法加工中的晶圆干燥:未来的挑战

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摘要

Although it has often been called into question, wet processing is still state-of-the-art in chip fabrication. And drying is the most important wet process step. Driven by technology developments and increasing performance requirements, the well-known Marangoni drying principle has been improved, and problems with watermarks on wafer surfaces have been eradicated.
机译:尽管经常被质疑,但湿法加工仍是芯片制造领域的最新技术。干燥是最重要的湿法工艺步骤。在技​​术发展和性能要求提高的推动下,众所周知的Marangoni干燥原理得到了改善,并且消除了晶片表面上水印的问题。

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