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A Fundamental Study of Wet Blast Processing : Solid Particle Size Effects on Processing Mechanism of Monocrytalline Silicon Wafer(Machine Elements, Design and Manufacturing)

机译：湿润加工的根本研究：固体粒度对单晶硅晶圆加工机理的影响（机械元件，设计和制造）

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Boyu DONG; Toshiro MIYAJIMA; Tohru MATSUBARA; Yoshiro IWAI;
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年度 2010
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A Fundamental Study of Wet Blast Processing : Solid Particle Size Effects on Processing Mechanism of Monocrytalline Silicon Wafer(Machine Elements, Design and Manufacturing)

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