首页> 外国专利> INTEGRATED DRY-WET PROCESSING APPARATUS AND METHOD FOR REMOVING MATERIAL ON SEMICONDUCTOR WAFERS USING DRY-WET PROCESSES

INTEGRATED DRY-WET PROCESSING APPARATUS AND METHOD FOR REMOVING MATERIAL ON SEMICONDUCTOR WAFERS USING DRY-WET PROCESSES

机译:集成干湿加工设备和利用干湿工艺去除半导体晶片上材料的方法

摘要

An apparatus 100 and method for removing materials, such as photoresist, on surfaces of objects, such as semiconductor wafers, utilizes one or more integrated dry-wet processing modules 102A, 102B, 102C to selectively perform plasma ashing and wet-chemical cleaning processes. Thus, a customized combination of plasma ashing and wet-chemical cleaning processes can be performed on a single platform to achieve desired processing results on the objects. In an embodiment, the apparatus may also include a critical dimension inspection unit to inspect the objects that are being processed by the apparatus.
机译:一种用于去除诸如半导体晶片之类的物体表面上的诸如光刻胶之类的材料的设备100和方法,其利用一个或多个集成的干湿处理模块102A,102B,102C来选择性地执行等离子体灰化和湿化学清洁工艺。因此,可以在单个平台上执行等离子体灰化和湿化学清洁工艺的定制组合,以在物体上实现所需的处理结果。在一个实施例中,该设备还可以包括临界尺寸检查单元,以检查该设备正在处理的物体。

著录项

  • 公开/公告号KR20040063920A

    专利类型

  • 公开/公告日2004-07-14

    原文格式PDF

  • 申请/专利权人 김 용배;

    申请/专利号KR20047006740

  • 发明设计人 김 용배;

    申请日2004-05-04

  • 分类号H01L21/306;

  • 国家 KR

  • 入库时间 2022-08-21 22:48:29

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