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INTEGRATED DRY-WET PROCESSING APPARATUS AND METHOD FOR REMOVING MATERIAL ON SEMICONDUCTOR WAFERS USING DRY-WET PROCESSES
INTEGRATED DRY-WET PROCESSING APPARATUS AND METHOD FOR REMOVING MATERIAL ON SEMICONDUCTOR WAFERS USING DRY-WET PROCESSES
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机译:集成干湿加工设备和利用干湿工艺去除半导体晶片上材料的方法
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摘要
An apparatus 100 and method for removing materials, such as photoresist, on surfaces of objects, such as semiconductor wafers, utilizes one or more integrated dry-wet processing modules 102A, 102B, 102C to selectively perform plasma ashing and wet-chemical cleaning processes. Thus, a customized combination of plasma ashing and wet-chemical cleaning processes can be performed on a single platform to achieve desired processing results on the objects. In an embodiment, the apparatus may also include a critical dimension inspection unit to inspect the objects that are being processed by the apparatus.
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