The Influence of QFN PACKAGE CONSTRUCTION on Solder Joint Durability

摘要

Solder joint integrity of components on printed circuit assemblies can be influenced by their construction parameters. This investigation documented how the die parameters of a QFN package can lead to solder joint integrity failure under IPC-9701 thermal cycle test conditions. Proactive reviews of BTC package construction can be used to avoid printed circuit assembly solder joint integrity issues.