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Plasma-Profile Control Using External Circuit in a Capacitively Coupled Plasma Reactor

机译:在电容耦合等离子体反应器中使用外部电路进行等离子体轮廓控制

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Very high frequency (VHF) capacitively coupled plasma (CCP) sources offer several benefits, including low plasma potential, high electron density, and controllable dissociation. However, standing electromagnetic waves can make the spatial structure of VHF plasmas a sensitive function of operating conditions and reactor geometry. This paper discusses how the profile of VHF CCPs can be controlled using an external circuit that modifies the electrical boundary conditions. A 2-D plasma model with external circuit has been used for this study, where networks of passive circuit elements can be connected to different electrodes in the reactor. Plasma simulations have been performed for several combinations of capacitors and inductors. It is found that the external circuit can be used to change the radio-frequency current return path, thereby modifying the plasma profile. In general, the plasma is pulled toward the electrode with an inductive impedance and pushed away from the electrode with a capacitive impedance. These changes in plasma profile are related to the relative voltage and their phase on different electrodes.
机译:极高频(VHF)电容耦合等离子体(CCP)源具有几个优点,包括低等离子体电势,高电子密度和可控的解离。但是,静置的电磁波会使VHF等离子体的空间结构成为操作条件和反应堆几何形状的敏感函数。本文讨论了如何使用外部电路修改电边界条件来控制VHF CCP的轮廓。具有外部电路的二维等离子体模型已用于此研究,其中无源电路元件的网络可以连接到反应堆中的不同电极。已经对电容器和电感器的几种组合进行了等离子体模拟。发现可以使用外部电路来改变射频电流返回路径,从而改变等离子体轮廓。通常,等离子体以电感性阻抗被拉向电极,并以电容性阻抗被推离电极。等离子体轮廓的这些变化与不同电极上的相对电压及其相位有关。

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