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Plasma profile control using external circuit in capacitively coupled plasma reactors

机译:使用电容耦合等离子体反应器中的外部电路的等离子体轮廓控制

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Summary form only given. Multi-frequency capacitively coupled plasma (CCP) sources in the range of 2-180 MHz are widely used for materials processing in the semiconductor industry. Very high frequency (VHF) sources bring various benefits including low plasma potential, high electron density, and controllable dissociation. Sources in the low frequency (LF) and high frequency (HF) regimes provide high ion energy with different ion energy distributions. Multi-frequency CCP reactors have been developed to combine the benefits of both frequency regimes. However, plasma structure can be difficult to control over a wide range of operating conditions (a few mTorr to several hundred mTorr, hundred to several thousand Watts, electropositive and electronegative chemistries). This paper discusses how the plasma structure can be controlled using external circuit impedance that modifies the plasma boundary conditions. A 2-dimensional plasma model with external circuit has been developed and used for this study. The plasma model considers conservation of charge species densities, momentum and energy along with the full set of Maxwell equations. The external circuit is a network of passive circuit elements connected to different electrodes. Plasma simulations have been performed for various external circuit configurations using combinations of capacitors and inductors. We found that the plasma structure and profile can be controlled by changing the current return path impedance. In general, the plasma is pulled towards the electrode with an inductive impedance and pushed away from the electrode with a capacitive impedance. When only capacitors are used, the plasma moves towards the electrode with lower impedance. As a result, the ion flux profile to the electrode can be controlled using the external circuit impedance. Electron density measurements using the resonance cavity method are used to verify that the electron density profile can indeed be modified using the external circuit- impedance.
机译:摘要表格仅给出。 2-180 MHz范围内的多频电容耦合等离子体(CCP)源广泛用于半导体工业中的材料加工。非常高的频率(VHF)源带来各种益处,包括低等离子体电位,高电子密度和可控解离。低频(LF)和高频(HF)制度的源提供具有不同离子能量分布的高离子能量。已经开发了多频CCP反应堆来结合频率制度的好处。然而,等离子体结构可能难以控制在各种操作条件下(几毫托,几百MTORR,百至数千瓦,电动负电和电负化学物质)。本文讨论了如何使用改变等离子体边界条件的外部电路阻抗来控制等离子体结构。具有外部电路的二维等离子体模型已经开发并用于本研究。等离子体模型考虑了充电物种密度,动量和能量以及全套麦克斯韦方程。外部电路是连接到不同电极的被动电路元件网络。已经使用电容器和电感器的组合对各种外部电路配置进行了等离子体模拟。我们发现可以通过改变电流返回路径阻抗来控制等离子体结构和轮廓。通常,等离子体以电感阻抗向朝向电极拉到电极上,并以电容阻抗从电极推开。当仅使用电容器时,等离子体朝向具有较低阻抗的电极移动。结果,可以使用外部电路阻抗来控制电极的离子磁通曲线。使用谐振腔方法的电子密度测量用于验证使用外部电路阻抗确实可以修改电子密度分布。

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