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Ion-Implant Isolated Vertical GaN p-n Diodes Fabricated with Epitaxial Lift-Off From GaN Substrates

机译:GaN衬底外延剥离制造的离子注入隔离垂直GaN p-n二极管

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Ion-implant isolated vertical GaN p-n junction diodes fabricated with epitaxiallift-off (ELO) from GaN substrates are demonstrated. For the ELO process, aband-gap selective photoelectrochemical (PEC) wet etch with a pseudomorphicInGaN release layer is utilized. Compared with devices isolated usingmesa etching, the ion-implant isolated devices exhibit more ideal forwardcurrent–voltage characteristics and lower leakage currents. Devices are alsocompared with and without ELO processing. Devices measured after ELOprocessing and mounting to metallized carrier substrates show similarelectrical performance to GaN-on-GaN control samples without ELO processing.No indication of material quality degradation is found on the ELOdevices. The ELO devices exhibit turn-on voltages of 3.15 V (at a currentdensity of 100 A cm~(-2)), with specific on resistance (R_(on)) of 0.52mΩcm~2 at4.8 V and breakdown voltage (V_(br)) approximately of 750 V.
机译:演示了利用GaN衬底外延 r n提离(ELO)制造的离子注入隔离垂直GaN p-n结二极管。对于ELO工艺,利用具有拟态 r nInGaN释放层的 n n带隙选择性光电化学(PEC)湿法刻蚀。与使用 n nmesa蚀刻隔离的器件相比,离子注入隔离的器件具有更理想的正向 n n电流-电压特性和较低的泄漏电流。使用和不使用ELO处理的设备也都比较。在ELO处理并安装到金属化载体衬底上后测量的器件显示出与未经ELO处理的GaN-on-GaN对照样品类似的电性能。 r n在ELO上未发现材料质量下降的迹象 r n ndevices。 ELO器件的开启电压为3.15 V(在电流 r 密度为100 A cm〜(-2)时),导通电阻(R_(on))在at r n4时为0.52mΩcm〜2 .8 V和大约750 V的击穿电压(V_(br))。

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