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Roles for aluminium indium nitride insertion layers in fabrication of GaN-based microcavities

机译:铝铟氮化物插入层在GaN基微腔制造中的作用

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AlInN alloys achieve an in-plane lattice match to hexagonal GaN at an indium nitride mole fraction of ~18%. Meanwhile Al_(0.82)In_(0.18)N displays a refractive index contrast of ~7% with GaN at visible wavelengths. We illustrate the use of Al_(0.82)In_(0.18)N insertion layers to control layer thicknesses during homoepi-taxial growth of GaN-based microcavities, using in situ optical reflectometry. The structures discussed are 3λ/2 microcavities incorporating distributed InGaN quantum wells tailored for emission at ~400 nm. As-grown samples have been characterised by techniques including cathodoluminescence spectroscopy. In addition to their role in growth monitoring, there are several post-growth processing steps in which Al_(0.82)In_(0.18)N insertion layers can assist microcavity fabrication. We focus here on a demonstration of the ~1:5 etch rate selectivity obtainable between Al_(0.82)In_(0.18)N and GaN in reactive ion etching.
机译:AlInN合金的氮化铟摩尔分数约为18%,可实现与六方GaN的面内晶格匹配。同时,Al_(0.82)In_(0.18)N与GaN在可见光波长下的折射率对比约为7%。我们使用原位光学反射法说明了在GaN基微腔的同质外延生长过程中使用Al_(0.82)In_(0.18)N插入层来控制层的厚度。所讨论的结构是3λ/ 2微腔,并结合了专为〜400 nm发射而设计的分布式InGaN量子阱。生长的样品已通过包括阴极荧光光谱的技术进行了表征。除了它们在生长监控中的作用外,还有几个生长后处理步骤,其中Al_(0.82)In_(0.18)N插入层可协助微腔制造。在这里,我们集中于演示在反应离子刻蚀中,Al_(0.82)In_(0.18)N和GaN之间可获得的〜1:5刻蚀速率选择性。

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