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Analysis of buffer-trapping effects on gate lag, drain lag and current collapse in AlGaN/GaN HEMTs

机译:分析缓冲陷阱对AlGaN / GaN HEMT中栅极滞后,漏极滞后和电流崩溃的影响

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摘要

Transient simulations of AlGaN/GaN HEMTs are performed in which a deep donor and a deep acceptor are considered in a semi-insulating buffer layer. Quasi-pulsed I-V curves are derived from the transient characteristics, and are compared with steady-state I-V curves. It is shown that the lag phenomena and current collapse could be reproduced. Particularly, the gate lag is correlated with relatively high source access resistance of the FETs. The current collapse is shown to be-rnmore pronounced when the deep-acceptor density in the buffer layer is higher and when an off-state drain voltage is higher, because trapping effects become more significant. It is suggested that to minimize current collapse in AlGaN/GaN HEMTs, an acceptor density in the buffer layer should be made low, although the current cutoff behavior may be degraded.
机译:进行了AlGaN / GaN HEMT的瞬态仿真,其中在半绝缘缓冲层中考虑了深施主和深受主。准脉冲I-V曲线是根据瞬态特性得出的,并与稳态I-V曲线进行比较。结果表明,可以再现滞后现象和电流崩塌。特别地,栅极滞后与FET的相对较高的源极访问电阻相关。当缓冲层中的深受体密度较高和截止态漏极电压较高时,电流陷落被显示为更明显,因为俘获效应变得更加明显。建议尽量减小AlGaN / GaN HEMT中的电流崩溃,尽管电流截止行为可能会降低,但应降低缓冲层中的受体密度。

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