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Nonvolatile memory performance improvements for solution-processed thin-film transistors with composition-modified In-Zn-Ti-0 active channel and ferroelectric copolymer gate insulator

机译:具有成分修饰的In-Zn-Ti-0有源沟道和铁电共聚物栅极绝缘体的固溶处理薄膜晶体管的非易失性存储器性能改进

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摘要

The nonvolatile memory thin-film transistors (M-TFTs) using a solution-processed indium-zinc-titanium oxide (IZTiO) active channel and a poly(vinylidene fluoride-trifluoroethyl-ene) ferroelectric gate insulator were fabricated and characterized to elucidate the relationships between the IZTiO channel composition and the memory performances such as program speed and data retention. The compositions of the spin-coated IZTiO layers were modified with different Ti amounts of 0, 2, 5, and 10 mol%. The carrier concentration of IZTiO channel layer was effectively modulated by the incorporated Ti amounts and the defect densities within the channel were effectively reduced by Ti incorporation. The M-TFT fabricated with IZTiO channel with 2-mol% Ti composition exhibited the best overall device performances, in which the μ_(EF) SS, MW, and programmed I_(on/off) were obtained to be 23.6 cm~2 V~(-1) s~(-1) 701 mV/decade, 11.8 V, and 1.2 × 10~5, respectively. Furthermore, thanks to the suitable amounts of Ti incorporation into the IZO, the improved program speed and data retention properties were successfully confirmed.
机译:制备了使用溶液处理的铟锌钛氧化物(IZTiO)有源沟道和聚偏二氟乙烯-三氟乙烯铁电栅绝缘体的非易失性存储薄膜晶体管(M-TFT),并对其特性进行了描述,以阐明它们之间的关系。 IZTiO通道组成与存储性能(如程序速度和数据保留)之间的关系。用0、2、5和10mol%的不同Ti量改性旋涂的IZTiO层的组成。通过掺入Ti量可以有效地调节IZTiO通道层的载流子浓度,并且通过掺入Ti可以有效地降低通道内的缺陷密度。以2mol%Ti组成的IZTiO沟道制造的M-TFT表现出最佳的整体器件性能,其中μ_(EF)SS,MW和编程的I_(on / off)为23.6 cm〜2 V 〜(-1)s〜(-1)701 mV /十倍频,11.8 V和1.2×10〜5。此外,由于将适当量的Ti掺入IZO中,因此成功地证实了提高的编程速度和数据保留性能。

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