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On the radiation damage effects in semiconductors beyond the end of range of implanted protons at high energies and fluences

机译:在高能量和注量下超出注入质子范围末端的半导体中的辐射损伤效应

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In the present work the radiation damage effects induced by 5.88 MeV protons in Si and InP crystals, of ~400 and 325 μm thickness, respectively, are examined and analyzed for high fluences ranging between 10~(16) and 10~(18) particles/ cm~2. The irradiation occurs in the random mode by constantly rotating the targets in order to minimize the channeling perturbations, while the control of the induced damage is performed by utilizing the RBS/C technique on the inverse side of the crystals, implementing the proton beam at a reduced energy (E_p = 1.2 MeV). The experimental results reveal impressive extensions of the damage profiles well beyond the end of range of implanted protons. Conventional theoretical calculations, as well as standard SRIM predictions, seem to underestimate the induced effects. An attempt is made in order to explain the experimental spectra via the adoption of the Coulomb explosion model and the results are compared to other already existing in literature for different beam-target combinations.
机译:在本工作中,研究和分析了5.88 MeV质子分别对厚度约为400和325μm的Si和InP晶体产生的辐射损伤效应,并分析了10〜(16)和10〜(18)粒子之间的高通量。 /厘米〜2。通过不断旋转目标以使通道扰动最小化,以随机模式进行辐照,同时通过在晶体反面上利用RBS / C技术执行质子束的控制,从而对质子束进行照射来控制诱发的损伤。降低的能量(E_p = 1.2 MeV)。实验结果表明,损伤轮廓的扩展令人印象深刻,远远超出了植入质子的范围。常规的理论计算以及标准的SRIM预测似乎都低估了诱发的影响。为了通过采用库仑爆炸模型来解释实验光谱进行了尝试,并且将结果与文献中针对不同束目标组合的其他已有结果进行了比较。

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