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A 3D deep n-well CMOS MAPS for the ILC vertex detector

机译:用于ILC顶点检测器的3D深n阱CMOS MAPS

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摘要

This work presents the features of a new kind of deep n-well monolithic active pixel sensor (DNW-MAPS), called SDR1 (Sparsified Data Readout), which exploits the capabilities of vertical integration (3D) processing in view of the design of a high granularity detector for vertexing applications at the International Linear Collider (ILC).rnSDR1 inherits and extends the functional capabilities of DNW-MAPS fabricated in planar (2D) CMOS technology and is expected to show better collection efficiency with respect to 2D versions. The aim of the paper is to outline the features of analog and digital architecture of the SDR1 chip, together with circuit simulations data. Also some device simulation results concerning detection efficiency will be discussed.
机译:这项工作介绍了一种称为SDR1(稀疏数据读出)的新型深n阱单片有源像素传感器(DNW-MAPS)的功能,该传感器利用了垂直集成(3D)处理的功能rnSDR1继承并扩展了以平面(2D)CMOS技术制造的DNW-MAPS的功能,并且有望相对于2D版本显示出更高的收集效率。本文的目的是概述SDR1芯片的模拟和数字架构的特征,以及电路仿真数据。此外,还将讨论一些与检测效率有关的设备仿真结果。

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  • 作者单位

    Universita di Pavia, I-27100 Pavia, Italy INFN, Sezione di Pavia, I-27100 Pavia, Italy;

    rnUniversita di Bergamo, I-24044 Dalmine (BG), Italy INFN, Sezione di Pavia, I-27100 Pavia, Italy;

    rnUniversita di Pavia, I-27100 Pavia, Italy INFN, Sezione di Pavia, I-27100 Pavia, Italy;

    rnUniversita di Bergamo, I-24044 Dalmine (BG), Italy INFN, Sezione di Pavia, I-27100 Pavia, Italy;

    rnUniversita di Bergamo, I-24044 Dalmine (BG), Italy INFN, Sezione di Pavia, I-27100 Pavia, Italy;

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  • 原文格式 PDF
  • 正文语种 eng
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  • 关键词

    MAPS; 3D integration technologies; CMOS; front-end electronics;

    机译:地图;3D整合技术;CMOS;前端电子;

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