Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs

摘要

We measured and demonstrated the great advantages of embedded film capacitors in reducing power/ground inductive impedance and the suppression of SSN at frequencies up to 3 GHz for high-performance multilayer packages and PCBs. Eight-layer test PCBs were fabricated, and their inductive power/ground network impedances were measured as a function of film thickness, via distribution, and combined use with discrete decoupling capacitors, using a two-port self-impedance measurement method. This successfully demonstrated that the power/ground inductive impedance was reduced from 270 pH to 106 pH simply by using an embedded film capacitor instead of 16 discrete decoupling capacitors.