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Electrical Performance of Electronic Packaging, 2003
Electrical Performance of Electronic Packaging, 2003
召开年:
2003
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1.
Architecting interconnect
机译:
架构互连
作者:
Hofstee H.P.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
microprocessor chips;
electronics packaging;
thermal management (packaging);
cooling;
architecting interconnect;
I/O bandwidth;
power delivery;
cooling;
processor performance;
package design;
system design;
microprocessors;
microarchitecture;
2.
Toward a more robust and accurate fast integral equation solver for microchip applications
机译:
面向微芯片应用的更强大,更准确的快速积分方程求解器
作者:
Chew W.C.
;
Jiang L.J.
;
Chu Y.H.
;
Wang G.L.
;
Pan Y.C.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
integrated circuit modelling;
integral equations;
inhomogeneous media;
method of moments;
Green's function methods;
fast integral equation solver;
microchip modeling;
layered media;
solver low frequency breakdown;
method of moments;
electrostatic problem;
3.
A broadband CPW-to-microstrip via-less transition for on wafer package probing applications
机译:
宽带CPW到微带无孔过渡,适用于晶片封装探测应用
作者:
Zhu L.
;
Melde K.L.
;
Prince J.L.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
microstrip transitions;
coplanar waveguides;
electronics packaging;
impedance matching;
microwave measurement;
probes;
broadband CPW to microstrip via-less transition;
optimal design;
multiline TRL calibration standards;
on wafer package probing;
coplana;
4.
A CAD methodology for the characterization of wide on-chip buses
机译:
用于表征广泛的片上总线的CAD方法
作者:
Elfadel I.M.
;
Deutsch A.
;
Kopcsay G.
;
Rubin B.
;
Smith H.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
system buses;
circuit CAD;
circuit layout CAD;
integrated circuit layout;
circuit simulation;
crosstalk;
SPICE;
microprocessor chips;
CAD methodology;
full electrical characterization;
wide on-chip data buses;
accurate modeling;
design cycle;
back-end-of;
5.
A low-cost ceramic BGA package for 50 Gb/s multiplexing circuit
机译:
用于50 Gb / s多路复用电路的低成本陶瓷BGA封装
作者:
Shan L.
;
Trewhella J.
;
Baks C.
;
John R.
;
Dyckman W.
;
OConnor D.
;
Pillai E.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
multiplexing equipment;
ball grid arrays;
ceramic packaging;
flip-chip devices;
BiCMOS analogue integrated circuits;
circuit simulation;
alumina;
Ge-Si alloys;
MMIC;
multilayer ceramic BGA packages;
model-to-hardware correlation;
flip-chip multiplexing c;
6.
A new fast and accurate method of extracting the parasitics of multi-layer packages
机译:
一种提取多层封装寄生物的快速,准确的新方法
作者:
Young-Soek Hong
;
Joon-Ho Choi
;
Chang-Woo Ko
;
Jin-Won Kim
;
Gi-Joung Jang
;
Moon-Hyun Yoo
;
Jeong-Taek Kong
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
chip scale packaging;
integrated circuit design;
integrated circuit modelling;
integrated circuit interconnections;
multilayer packages;
chip scaled IC packages;
interconnect parasitic extraction method;
3D effect modeling;
variable shaped reference plan;
7.
A surface integral equation method for solving complicated electrically small structures
机译:
求解复杂的电小结构的表面积分方程法
作者:
Yunhui Chu
;
Weng Cho Chew
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
circuit analysis computing;
electric field integral equations;
electronics packaging;
matrix multiplication;
impedance matrix;
surface integral equation method;
complicated electrically small structures;
contact-region modeling;
interconnect analysis;
pa;
8.
Applications of closed-form wiring escape formulae to a high performance printed wiring board
机译:
封闭式逃逸公式在高性能印刷线路板上的应用
作者:
Tingdong Zhou
;
Katopis G.A.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
printed circuit layout;
electronics packaging;
multichip modules;
high performance printed wiring board;
closed-form wiring escape formulae;
area array;
standard horizontal ground rules;
lines per channel;
extra channels;
via technologies;
signal pin dep;
9.
BestFit: a SPICE-compatible model for efficient, passive, broadband transmission-line analysis of dispersive interconnects
机译:
BestFit:一种与SPICE兼容的模型,用于对分散互连进行高效,无源,宽带传输线分析
作者:
Woo A.
;
Yioultsis T.
;
Cangellaris A.C.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
SPICE;
transmission line matrix methods;
multiconductor transmission lines;
lumped parameter networks;
impedance matrix;
electric admittance;
Chebyshev approximation;
interconnections;
BestFit mathematical methodology;
SPICE-compatible models;
direct pas;
10.
Comprehensive broadband electromagnetic modeling of on-chip interconnects with a surface discretization-based generalized PEEC model
机译:
利用基于表面离散化的广义PEEC模型对片上互连进行全面的宽带电磁建模
作者:
Aosheng Rong
;
Cangellaris A.C.
;
Limin Dong
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
computational electromagnetics;
integrated circuit modelling;
integrated circuit interconnections;
integral equations;
equivalent circuits;
surface impedance;
mesh generation;
broadband electromagnetic modeling;
on-chip interconnects;
surface discretizat;
11.
De-embedding a device-under-test (DUT) using thru' measurements
机译:
使用直通测量去嵌入被测设备(DUT)
作者:
Chong-Jin Ong
;
Tripathi A.
;
Miller D.
;
Tsang L.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
printed circuit testing;
time-domain reflectometry;
microwave reflectometry;
deconvolution;
calibration;
transmission line theory;
piecewise constant techniques;
equivalent circuits;
interconnections;
approximate deembedding method;
device-under-test;
pr;
12.
Design and implementation of a 5GHz RF receiver front-end in LCP based system-on-package module with embedded chip technology
机译:
基于LCP和嵌入式芯片技术的5GHz RF接收机前端的设计和实现
作者:
Duo X.
;
Li-Rong Zheng
;
Tenhunen H.
;
Chen L.
;
Zou G.
;
Liu J.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
microwave receivers;
liquid crystal polymers;
modules;
Q-factor;
chip scale packaging;
RF receiver front-end;
wireless LAN;
liquid crystal polymer based system-on-package;
front-end module;
embedded chip technologies;
microwave performance;
RF performanc;
13.
Design and validation of a power supply noise reduction technique
机译:
电源降噪技术的设计和验证
作者:
Ji G.
;
Arabi T.
;
Taylor G.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
power supply circuits;
computer power supplies;
integrated circuit noise;
integrated circuit packaging;
equivalent circuits;
capacitors;
resistors;
microprocessor chips;
high performance microprocessors;
power supply noise;
reliable high speed bus operat;
14.
Efficient modeling of simultaneous switching noise in a realistic computer system
机译:
在现实的计算机系统中同时开关噪声的高效建模
作者:
Sungjun Chun
;
Haridass A.
;
OReilly C.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
computer power supplies;
transmission line theory;
method of moments;
driver circuits;
integrated circuit noise;
switching;
power integrated circuits;
I/O simultaneous switching noise;
power distribution;
numerically efficient modeling;
realistic compute;
15.
PILOT: a fast algorithm for enhanced 3D parasitic extraction efficiency
机译:
PILOT:一种提高3D寄生提取效率的快速算法
作者:
Gope D.
;
Jandhyala V.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
circuit analysis computing;
circuit CAD;
iterative methods;
octrees;
singular value decomposition;
method of moments;
Poisson equation;
computational complexity;
PILOT;
predetermined interaction list octree algorithm;
fast algorithm;
3D parasitic extract;
16.
Power distribution analysis methodology for a multi-gigabit I/O interface
机译:
千兆位I / O接口的配电分析方法
作者:
Schmitt R.
;
Huang X.
;
Yuan C.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
power supply circuits;
computer power supplies;
CMOS memory circuits;
integrated circuit noise;
transmission line matrix methods;
power distribution network;
multi-gigabit memory interfaces;
I/O circuits;
components modeling;
supply noise;
signal quality;
17.
Reduction in reflections and ground bounce for signal line through a split power plane by using differential coupled microstrip lines
机译:
通过使用差分耦合微带线,减少通过分离电源平面的信号线的反射和接地反弹
作者:
Guang-Hwa Shiue
;
Ruey-Beei Wu
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
microstrip discontinuities;
coupled circuits;
circuit noise;
finite difference time-domain analysis;
equivalent circuits;
differential coupled microstrip lines;
split power plane;
split ground plane;
ground bounce reflection reduction;
split power plane;
18.
Statistical approach to the EMI modeling of large ASICs by a single noise-current source
机译:
单一噪声电流源对大型ASIC EMI建模的统计方法
作者:
Antonini G.
;
Drewniak J.L.
;
Leone M.
;
Orlandi A.
;
Ricchiuti V.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
application specific integrated circuits;
integrated circuit noise;
electromagnetic interference;
frequency response;
integrated circuit modelling;
large complex ASIC;
propagating noise;
statistics based method;
powerbus planes;
lumped noise source model;
19.
The development of a macro-modeling tool to develop IBIS models
机译:
开发用于开发IBIS模型的宏建模工具
作者:
Varma A.
;
Glaser A.
;
Lipa S.
;
Steer M.
;
Franzon P.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
SPICE;
buffer circuits;
integrated circuit modelling;
driver circuits;
CMOS integrated circuits;
SPICE netlists;
macromodeling tool;
IBIS models;
input/output buffer information specification;
user-desirable SPICE engine;
dynamic characteristics;
static;
20.
The Nittany Genome Project: a genetic algorithm approach to optimize a worst case bitstream for package simulation
机译:
Nittany Genome Project:一种遗传算法方法,用于优化包装仿真的最坏情况比特流
作者:
Ulrich S.M.
;
Wirick A.M.
;
de Araujo D.
;
Pham N.
;
Cases M.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
circuit simulation;
genetic algorithms;
circuit optimisation;
jitter;
Perl;
SPICE;
electronics packaging;
Nittany Genome Project;
custom software;
genetic algorithm approach;
worst case bitstream;
package simulation;
short bitstream inputs;
worst case ji;
21.
T-REX, a blade packaging architecture for mainframe servers
机译:
T-REX,大型机服务器的刀片包装架构
作者:
Katopis G.A.
;
Becker W.D.
;
Harrer H.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
system buses;
multichip modules;
thermal management (packaging);
mainframes;
mainframe servers;
T-REX blade packaging architecture;
z-series;
e-servers;
system performance;
processing operating frequency;
symmetric multiprocessing architecture;
I/O circu;
22.
An efficient pre-layout on-chip inductance noise modeling tool for bus design
机译:
用于总线设计的高效预布局片上电感噪声建模工具
作者:
Mazumder M.
;
Bohnke R.
;
Husain A.
;
Grannes D.
;
Chiprout E.
;
Lei Sun
;
Menon S.
;
Eells J.
;
Changhong Dai
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
system buses;
integrated circuit modelling;
circuit simulation;
circuit optimisation;
microprocessor chips;
RLC circuits;
crosstalk;
inductance;
circuit CAD;
on-chip inductance noise;
inductance noise modeling tool;
bus design;
global on-chip interconnec;
23.
Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system
机译:
低抖动混合模式系统中多层封装和PCB分离电源/地平面的噪声隔离方法分析
作者:
Youchul Jeong
;
Hyungsoo Kim
;
Jingook Kim
;
Jongbae Park
;
Joungho Kim
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
printed circuit testing;
circuit noise;
electric noise measurement;
jitter;
network analysis;
noise isolation methods;
PCB split power/ground plane;
low jitter mixed mode system;
multilayered package;
frequency domain measurement;
time domain measurement;
24.
Application of Design of Experiments (DOE) methods to high-speed interconnect validation
机译:
实验设计(DOE)方法在高速互连验证中的应用
作者:
Norman A.
;
Shykind D.
;
Falconer M.
;
Ruffer K.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
design of experiments;
printed circuit layout;
interconnections;
system buses;
electronics packaging;
high-speed interconnect validation;
design of experiments;
model fitting;
high volume conditions;
buffer compensation;
motherboard interconnect;
worst c;
25.
CAD flows for chip-package codesign
机译:
芯片封装代码签名的CAD流程
作者:
Varma A.
;
Glaser A.
;
Franzon P.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
circuit layout CAD;
integrated circuit layout;
multichip modules;
integrated circuit packaging;
flip-chip devices;
chip-package codesign;
CAD flows;
unified method;
layout design;
commercial design environment;
design time;
integrated circuit design;
con;
26.
Chip-package co-design for high-speed transmitter in serial links application
机译:
串行链路应用中高速发射机的芯片封装协同设计
作者:
Shen M.
;
Jian Liu
;
Li-Rong Zheng
;
Tenhunen H.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
radio transmitters;
transceivers;
ball grid arrays;
lead bonding;
chip scale packaging;
current-mode logic;
chip-package codesign;
high-speed transmitter;
serial links application;
package parasitics;
impedance-controlled signal channel;
power efficient;
27.
Chip-package co-design of common emitter LNA in system-on-package with on-chip versus off-chip passive component analysis
机译:
系统级封装中共发射极LNA的芯片封装协同设计以及片上和片外无源组件分析
作者:
Duo X.
;
Li-Rong Zheng
;
Tenhunen H.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
MMIC amplifiers;
microwave receivers;
chip scale packaging;
BiCMOS analogue integrated circuits;
multichip modules;
integrated circuit modelling;
integrated circuit design;
common emitter LNA;
system-on-package;
WLAN application;
chip-package codesign;
p;
28.
CPU power supply impedance profile measurement using FFT and clock gating
机译:
使用FFT和时钟门控测量CPU电源阻抗分布
作者:
Waizman A.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
computer power supplies;
power integrated circuits;
power supply circuits;
clocks;
electric impedance measurement;
fast Fourier transforms;
digital phase locked loops;
CPU power supply;
bypass mode clock gating;
oscilloscope FFT features;
impedance profi;
29.
Delay extraction and passive macromodeling of lossy coupled transmission lines
机译:
有损耦合传输线的延迟提取和被动宏建模
作者:
Dounavis A.
;
Nakhla N.
;
Achar R.
;
Nakhla M.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
coupled transmission lines;
transmission line matrix methods;
delay lines;
equivalent circuits;
rational functions;
lossy coupled transmission lines;
passive macromodeling;
delay extraction;
long lossy delay lines;
exponential stamp;
matrix rational appr;
30.
Design and analysis of multi-gigahertz parallel bus interfaces of low-cost and band-limited channels
机译:
低成本和带宽受限通道的多千兆赫兹并行总线接口的设计和分析
作者:
Beyene W.T.
;
Cheng N.
;
Yuan C.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
decision feedback equalisers;
transceivers;
timing jitter;
interconnections;
intersymbol interference;
printed circuits;
ball grid arrays;
flip-chip devices;
system buses;
bandwidth limiting factors;
low-cost interconnect system;
equalization techniques;
31.
Design and modeling challenges for DDR II memory subsystems
机译:
DDR II内存子系统的设计和建模挑战
作者:
Wirick A.
;
Ulrich S.
;
Pham N.
;
Cases M.
;
de Araujo D.N.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
memory cards;
printed circuit design;
system buses;
timing;
jitter;
crosstalk;
intersymbol interference;
circuit noise;
circuit optimisation;
DDR II memory interface;
DDR II memory subsystems;
electrical packaging;
source-synchronous memory subsystems;
d;
32.
Design space exploration of high-speed busses using statistical methods
机译:
基于统计方法的高速客车设计空间探索
作者:
Matoglu E.
;
Swaminathan M.
;
Cases M.
;
Pham N.
;
Araujo D.N.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
peripheral interfaces;
regression analysis;
normal distribution;
sensitivity analysis;
high-speed bus;
design space exploration;
efficient statistical method;
data rate;
local I/O bus;
parametric yield;
PCI-X;
signal integrity measures;
sensitivity relat;
33.
Determination of frequency dependent transmission line parameters on product related on chip test line structures using S-parameter measurements
机译:
使用S参数测量确定与芯片测试线结构相关的产品的频率相关传输线参数
作者:
Winkel T.-M.
;
Ktata M.F.
;
Ludwig T.
;
Schettler H.
;
Grabinski H.
;
Klink E.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
integrated circuit interconnections;
transmission lines;
S-parameters;
integrated circuit measurement;
characteristic impedance;
propagation constant;
embedded transmission lines;
frequency dependent transmission line parameters;
on chip test line struct;
34.
Distributed on-chip power grid modeling: an electromagnetic alternative to RLC extraction-based models
机译:
分布式片上电网建模:电磁替代基于RLC提取的模型
作者:
Jae-Yong Ihm
;
Cangellaris A.C.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
power supply circuits;
Maxwell equations;
integrated circuit modelling;
circuit simulation;
electronic design automation;
computational electromagnetics;
electromagnetic interference;
on-chip power grid modeling;
distributed modeling;
electromagnetic acc;
35.
Efficient full-wave analysis of packaging interconnects with bends using the method of moments
机译:
使用矩量法对带有弯头的封装互连进行全波高效分析
作者:
Zhaohui Zhu
;
Dvorak S.L.
;
Prince J.L.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
network analysis;
method of moments;
interconnections;
electronics packaging;
full-wave analysis;
MoM;
packaging interconnect bends;
full-wave layered interconnect simulator;
UA-FWLIS;
bend-cell expansion function;
36.
Enforcing bounded realness of S parameter through trace parameterization
机译:
通过跟踪参数化来增强S参数的有界真实性
作者:
Huabo Chen
;
Jiayuan Fang
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
S-parameters;
multiport networks;
state-space methods;
circuit optimisation;
circuit simulation;
rational functions;
circuit complexity;
transient analysis;
bounded realness;
S parameter;
trace parameterization;
macromodel;
stable rational function;
boun;
37.
Experimental validation of crosstalk simulations for on-chip interconnects at high frequencies using S-parameters
机译:
使用S参数在高频下对片上互连进行串扰仿真的实验验证
作者:
Kobrinsky M.J.
;
Chakravarty S.
;
Dan Jiao
;
Harmes M.
;
List S.
;
Mazumder M.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
circuit simulation;
integrated circuit modelling;
integrated circuit measurement;
integrated circuit interconnections;
S-parameters;
crosstalk;
computational electromagnetics;
coupled circuits;
integrated circuit noise;
crosstalk simulation;
high-frequen;
38.
Extraction of /spl epsiv/(f) and tan /spl delta/(f) for BT insulator up to 30 GHz using the short-pulse propagation technique
机译:
使用短脉冲传播技术提取高达30 GHz的BT绝缘子的/ spl epsiv /(f)和tan / spl delta /(f)
作者:
Deutsch A.
;
Winkel T.-M.
;
Kopcsay G.V.
;
Surovic C.W.
;
Rubin B.J.
;
Katopis G.A.
;
Chamberlin B.J.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
permittivity measurement;
dielectric loss measurement;
microwave measurement;
interconnections;
pulse measurement;
rational functions;
iterative methods;
printed circuits;
transmission line theory;
step response;
bismaleimide triazine;
epoxy-resin;
BT in;
39.
Extraction of current signatures for simulation of simultaneous switching noise in high speed digital systems
机译:
提取电流信号以模拟高速数字系统中的同时开关噪声
作者:
Mandrekar R.
;
Swaminathan M.
;
Sungjun Chun
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
computer power supplies;
power supply circuits;
power integrated circuits;
integrated circuit noise;
integrated circuit modelling;
high-speed integrated circuits;
circuit simulation;
current signatures extraction;
simultaneous switching noise;
high speed;
40.
Frequency-dependent characterization of bulk and ceramic bypass capacitors
机译:
大容量和陶瓷旁路电容器的频率相关特性
作者:
Novak I.
;
Miller J.R.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
ceramic capacitors;
electric resistance measurement;
inductance measurement;
capacitance measurement;
resonance;
series resonance frequency;
capacitor frequency-dependent characterization;
bulk capacitors;
ceramic bypass capacitors;
power distribution ne;
41.
Generation of passive macromodels from transient port responses
机译:
从瞬态端口响应生成被动宏模型
作者:
Grivet-Talocia S.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
multiport networks;
lumped parameter networks;
transient response;
eigenvalues and eigenfunctions;
finite difference time-domain analysis;
transfer function matrices;
Laplace transforms;
iterative methods;
least squares approximations;
curve fitting;
cir;
42.
Hybrid method for frequency-dependent lossy coupled transmission line characterization and modeling
机译:
频率相关的有损耦合传输线特性与建模的混合方法
作者:
Joong-Ho Kim
;
Dong-Ho Han
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
coupled transmission lines;
multiconductor transmission lines;
high-frequency transmission lines;
S-parameters;
electric impedance;
computational electromagnetics;
S-matrix theory;
permittivity;
dielectric losses;
electrical conductivity;
S-parameter mea;
43.
Impact of FR4 dielectric non-uniformity on the performance of multi-Gb/s differential signals
机译:
FR4介电不均匀性对多Gb / s差分信号性能的影响
作者:
Heck H.
;
Hall S.
;
Horine B.
;
Mallory K.
;
Wig T.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
printed circuit design;
network analysis;
permittivity;
dielectric materials;
physical PCB structure;
FR4 dielectric nonuniformity;
high-speed differential signals;
phase skew;
local dielectric constant spatial variation;
HSpice models;
frequency domain;
44.
Impact of high impedance mid-frequency noise on power delivery
机译:
高阻抗中频噪声对功率传输的影响
作者:
Hsiao-Ping Tsai
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
power supply circuits;
computer power supplies;
SPICE;
finite difference time-domain analysis;
integrated circuit noise;
frequency response;
transient response;
ball grid arrays;
integrated circuit packaging;
switching;
core switching noise analysis;
pow;
45.
Including dispersive dielectrics in PEEC models
机译:
在PEEC模型中包括色散电介质
作者:
Antonini G.
;
Ruehli A.E.
;
Haridass A.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
circuit simulation;
equivalent circuits;
dielectric losses;
permittivity;
dispersive media;
convolution;
SPICE;
partial element equivalent circuit models;
dielectric model;
dielectric losses;
recursive convolution;
circuit synthesis;
Lorentzian model;
co;
46.
Integral equation based time domain coupled EM-circuit simulation for packaged conductors and dielectrics
机译:
基于积分方程的时域耦合EM电路仿真,用于封装导体和电介质
作者:
Chuanyi Yang
;
Gong Ouyang
;
Vikram Jandhyala
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
circuit simulation;
computational electromagnetics;
integral equations;
coupled circuits;
lumped parameter networks;
nonlinear network analysis;
electromagnetic interference;
mesh generation;
integral equation based EM-circuit simulation;
packaged conduc;
47.
Integrated power grid modeling and analysis
机译:
集成电网建模与分析
作者:
Yong Wang
;
Quint D.
;
Fetzer E.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
circuit simulation;
power supply circuits;
integrated circuit modelling;
SPICE;
integrated circuit packaging;
integrated circuit layout;
circuit layout CAD;
RLC circuits;
capacitance;
inductance;
integrated power grid modeling;
loop-based inductance mode;
48.
Macro-modeling of non-linear I/O drivers using spline functions and finite time difference approximation
机译:
使用样条函数和有限时差近似对非线性I / O驱动器进行宏建模
作者:
Mutnury B.
;
Swaminathan M.
;
Libous J.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
driver circuits;
digital integrated circuits;
SPICE;
splines (mathematics);
circuit simulation;
integrated circuit modelling;
macromodeling methodology;
spline functions;
finite time difference;
digital I/O drivers;
nonlinear driver circuits;
static char;
49.
Maintaining microprocessor compatibility across process generations
机译:
维护各代处理器之间的微处理器兼容性
作者:
Sarangi A.
;
Babcock S.R.
;
Jones J.R.
;
Taylor G.F.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
microprocessor chips;
power supply circuits;
computer power supplies;
driver circuits;
chip-on-board packaging;
socket compatibility;
microprocessor compatibility;
process generations;
termination resistors;
microprocessor package;
current balancing sche;
50.
Mitigating multi-layer PCB power bus radiation through novel mesh fencing techniques
机译:
通过新颖的网格隔离技术减轻多层PCB电源总线的辐射
作者:
Xin Wu
;
Kermani M.H.
;
Ramahi O.M.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
printed circuits;
power supply circuits;
finite element analysis;
electromagnetic shielding;
electromagnetic interference;
multilayer PCB;
PCB power bus radiation;
mesh fencing techniques;
induced radiation;
fast switching;
finite element method full wav;
51.
Mixed signal validation of the Intel/spl reg/ Pentium/spl reg/ 4 microprocessor power-up sequence
机译:
Intel / spl reg / Pentium / spl reg / 4微处理器加电序列的混合信号验证
作者:
Pan
;
Y.C.
;
Mughal
;
U.A.
;
Rifani
;
M.C.
;
Wilson
;
T.M.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
microprocessor chips;
power supply circuits;
computer power supplies;
circuit simulation;
logic simulation;
SPICE;
integrated circuit modelling;
digital phase locked loops;
circuit CAD;
logic CAD;
robust microprocessor design;
Intel Pentium 4 microproces;
52.
Model order reduction of electromagnetic systems and RLC circuits for power plane resonance analysis
机译:
用于功率平面谐振分析的电磁系统和RLC电路的模型降阶
作者:
Watanabe T.
;
Asai H.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
linear network analysis;
RLC circuits;
lumped parameter networks;
printed circuit design;
reduced order systems;
circuit resonance;
circuit simulation;
linear RLC lumped circuits;
EM system model order reduction;
electromagnetic systems;
RLC circuits;
po;
53.
Modeling of non-ideal planes in stripline structures
机译:
带状线结构中非理想平面的建模
作者:
Engin A.E.
;
John W.
;
Sommer G.
;
Mathis W.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
multiconductor transmission lines;
transmission line matrix methods;
electric admittance;
strip lines;
multiconductor transmission line model;
stripline structures;
signal lines interaction;
power planes;
nonideal planes;
finite-width planes;
equivalent;
54.
Multipoint moment matching based model generation for complex systems
机译:
基于多点矩匹配的复杂系统模型生成
作者:
Huabo Chen
;
Ji Zheng
;
Jiayuan Fang
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
circuit simulation;
method of moments;
reduced order systems;
S-parameters;
rational functions;
matrix algebra;
multipoint moment matching based model generation;
reduced order modeling;
broadband macromodel;
complex systems;
least square matrix;
high or;
55.
Open load backward matching (OLBM) technique for low ISI differential H-tree clock and data transmission
机译:
开放负载后向匹配(OLBM)技术可实现低ISI差分H树时钟和数据传输
作者:
Daehyun Chung
;
Seungyong Baek
;
Joungho Kim
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
intersymbol interference;
clocks;
power supply circuits;
impedance matching;
open load backward matching;
low ISI transmission;
data transmission;
clock transmission;
differential H-tree;
signal quality;
high speed digital systems;
impedance mismatch;
56.
Optimum design of power distribution system via clock modulation
机译:
通过时钟调制对配电系统进行优化设计
作者:
Weekly R.
;
Chun S.
;
Haridass A.
;
OReilly C.
;
Jordan J.
;
OConnell F.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
computer power supplies;
power supply circuits;
clocks;
modulation;
microprocessor chips;
current excitations;
microprocessor power distribution system;
clock modulation technique;
optimum design;
gating function;
logic systems;
57.
Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench
机译:
高速硅光具座上的10 Gbps激光二极管的封装设计和测量
作者:
Schuster C.
;
Kuchta D.M.
;
Colgan E.G.
;
Cohen G.M.
;
Trewhella J.M.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
optical transmitters;
semiconductor lasers;
integrated optoelectronics;
semiconductor device packaging;
impedance matching;
electrical package design;
laser diode;
silicon optical bench;
wideband impedance matching;
packaging platform;
low cost;
precisio;
58.
Package model synthesis
机译:
封装模型综合
作者:
Young B.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
electronics packaging;
electronic design automation;
visual databases;
flip-chip devices;
ball grid arrays;
package model synthesizer;
package description language;
signal integrity;
package layout;
model netlist;
design databases;
general-purpose electr;
59.
Parallel plate waveguide with radiating slot modeling using two dimensional frequency domain transmission line matrix method
机译:
二维频域传输线矩阵法的辐射槽建模平行板波导
作者:
Ito R.
;
Jackson R.W.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
transmission line matrix methods;
method of moments;
parallel plate waveguides;
waveguide theory;
waveguide discontinuities;
microstrip antenna arrays;
antenna phased arrays;
antenna earths;
antenna theory;
frequency-domain analysis;
transmission line ma;
60.
Partitioned conduction modes in surface integral equation-based impedance extraction
机译:
基于表面积分方程的阻抗提取中的分区传导模式
作者:
Xin Hu
;
Daniel L.
;
White J.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
integrated circuit packaging;
integrated circuit modelling;
integrated circuit interconnections;
electric field integral equations;
computational electromagnetics;
Galerkin method;
iterative methods;
Green's function methods;
circuit analysis computing;
61.
Physically-based distributed models for multi-layer ceramic capacitors
机译:
基于物理的多层陶瓷电容器分布式模型
作者:
Sullivan C.R.
;
Yuqin Sun
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
ceramic capacitors;
inductance;
transmission line theory;
electronics packaging;
multilayer ceramic capacitors;
physically-based distributed models;
transmission-line model;
characteristic impedance;
round-trip time;
eddy-current losses;
packaging;
62.
Power distribution system for JEDEC DDR2 memory DIMM
机译:
JEDEC DDR2内存DIMM的配电系统
作者:
Smith L.D.
;
Lee J.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
integrated circuit packaging;
multichip modules;
power supply circuits;
integrated memory circuits;
ceramic capacitors;
SPICE;
frequency-domain analysis;
inductance;
capacitance;
power distribution system;
JEDEC DDR2 dual inline memory module;
target imp;
63.
Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model
机译:
基于平衡TLM和通孔耦合模型的通孔信号通孔激发的电源/接地平面边缘辐射的预测和验证
作者:
Jun So Pak
;
Junwoo Lee
;
Hyungsoo Kim
;
Joungho Kim
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
printed circuit design;
transmission line matrix methods;
coupled circuits;
circuit resonance;
power/ground plane edge radiation;
through-hole signal via excited radiation;
balanced TLM model;
via coupling model;
power/ground plane resonance;
via broken;
64.
Reduction in radiated emission using CSP with built-in decoupling components
机译:
使用内置去耦组件的CSP减少辐射
作者:
Nakano K.
;
Sudo T.
;
Haga S.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
chip scale packaging;
electromagnetic interference;
integrated circuit measurement;
integrated circuit design;
integrated circuit modelling;
equivalent circuits;
CSP radiated emission reduction;
built-in decoupling components;
chip size package;
current;
65.
Signal integrity study of 1000 ball grid array package construction effects on DDR2 at 533MHz
机译:
1000个球栅阵列封装构造对DDR2的533MHz信号完整性研究
作者:
Wyland C.
;
Nunn W.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
power supply circuits;
computer power supplies;
integrated memory circuits;
timing jitter;
ball grid arrays;
flip-chip devices;
SPICE;
multichip modules;
DDR2 memory specification;
performance requirements;
ball grid array;
package construction effects;
66.
Simulation and sensitivity computation of nonuniform transmission lines via integrated congruence transform
机译:
基于集成同余变换的非均匀传输线仿真与灵敏度计算
作者:
Gad E.
;
Nakhla M.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
multiconductor transmission lines;
sensitivity analysis;
circuit simulation;
reduced order systems;
SPICE;
transmission line matrix methods;
nonuniform transmission lines;
integrated congruence transform;
sensitivity analysis;
multiconductor transmission;
67.
Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
机译:
基于无损测量的无线应用低成本无铅封装的统计分析和建模
作者:
Pfeiffer U.
;
Chandrasekhar A.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
chip-on-board packaging;
interconnections;
S-parameters;
statistical analysis;
modelling;
microwave reflectometry;
RF performance;
quad flat no-lead package;
high volume assembly;
distributed model;
chip-to-package interconnect;
low-cost leadless package;
68.
Synthesis method for design of power distribution network in high-speed digital systems
机译:
高速数字系统配电网设计的综合方法
作者:
Yong-Ju Kim
;
Jong-Ho Kang
;
KunWoo-Park
;
Jae-Kyung Wee
;
Ki-Ho Hong
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
power supply circuits;
capacitors;
electronics packaging;
equivalent circuits;
network synthesis;
power distribution network;
high-speed digital systems;
synthesis methodology;
design methodology;
path-based equivalent circuit model;
on-chip decoupling c;
69.
The necessity and consequences of modeling driver and load nonlinearity in on-chip global interconnect noise verification
机译:
在芯片上全局互连噪声验证中对驱动器和负载非线性建模的必要性和结果
作者:
Feldmann P.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
integrated circuit noise;
circuit simulation;
driver circuits;
digital integrated circuits;
lumped parameter networks;
transmission line theory;
integrated circuit interconnections;
circuit layout CAD;
on-chip global interconnect;
noise verification;
loa;
70.
Using shadow lines to assure accurate signal return current in electrical package analysis codes
机译:
使用阴影线确保电气封装分析代码中的准确信号返回电流
作者:
Rubin B.J.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
electronics packaging;
circuit analysis computing;
inductance;
capacitance;
method of moments;
moment-method codes;
accurate signal return current;
full wave modeling;
inductive modeling;
electrical package analysis codes;
shadow lines;
rectangularly gri;
71.
What-if analyses of multi-layer PWB embedded in the digital still camera with parallel-distributed FDTD-based simulator 'BLESS'
机译:
使用基于并行分布式FDTD的模拟器“ BLESS”对嵌入在数码相机中的多层PWB进行假设分析
作者:
Araki K.
;
Kubota H.
;
Watanabe T.
;
Asai H.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
finite difference time-domain analysis;
printed circuit layout;
electromagnetic interference;
electromagnetic compatibility;
multichip modules;
circuit simulation;
crosstalk;
transient analysis;
SPICE;
CCD image sensors;
full-wave EMI simulator;
BLESS;
b;
72.
Compensation of ESD and input capacitance effect by using package bondwire inductance for over Gbps differential SerDes devices
机译:
通过对超过Gbps的差分SerDes器件使用封装键合线电感来补偿ESD和输入电容效应
作者:
Seungyoung Ahn
;
Jongbae Park
;
Daehyun Chung
;
Joungho Kim
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
lead bonding;
ball grid arrays;
electrostatic discharge;
compensation;
inductance;
integrated circuit packaging;
transceivers;
electrostatic discharge compensation;
input capacitance effect;
package bondwire inductance;
optimized inductance;
time-domain;
73.
Design and analysis of embedded inductor on low cost multilayer laminate MCM technology
机译:
低成本多层层压MCM技术的嵌入式电感器设计与分析
作者:
Lee R.C.
;
Gye-An Lee
;
Megahed M.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
multichip modules;
inductors;
inductance;
embedded inductor;
multilayer laminate MCM;
low cost substrate;
RF measurement;
dielectric stack-up;
process variation effect;
inductance variation;
two-layer inductor;
74.
Dispersion and resonance of on-chip interconnect lines with underlayer orthogonal metal grids
机译:
带有底层正交金属栅的片上互连线的色散和共振
作者:
Pingshan Wang
;
Kan E.C.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
integrated circuit interconnections;
integrated circuit measurement;
integrated circuit modelling;
antenna theory;
circuit resonance;
dispersion (wave);
rectangular patch antenna theory;
on-chip interconnect lines;
underlayer orthogonal metal grids;
inte;
75.
Effect of substrate resistivity on switching noise in on-chip power distribution networks
机译:
衬底电阻率对片上配电网络中开关噪声的影响
作者:
Jifeng Mao
;
Swaminathan M.
;
Libous J.
;
OConnor D.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
power integrated circuits;
power supply circuits;
computer power supplies;
integrated circuit noise;
conformal mapping;
finite difference time-domain analysis;
switching;
substrate loss;
simultaneous switching noise;
on-chip power distribution networks;
76.
Enforcing passivity for rational function based macromodels of tabulated data
机译:
增强基于有理函数的列表数据宏模型的无源性
作者:
Saraswat D.
;
Achar R.
;
Nakhla M.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
multiport networks;
linear network analysis;
distributed parameter networks;
circuit simulation;
transmission line theory;
transient analysis;
eigenvalues and eigenfunctions;
electric admittance;
state-space methods;
rational functions;
rational function;
77.
Experimental characterization of copper/low-k transmission line interconnects through microwave measurements
机译:
通过微波测量对铜/低k传输线互连进行实验表征
作者:
Jooyong Kim
;
Neikirk D.P.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
integrated circuit interconnections;
integrated circuit measurement;
copper;
silicon compounds;
microwave measurement;
S-parameters;
dielectric loss measurement;
permittivity measurement;
copper/low-k transmission line interconnects;
microwave measuremen;
78.
Impact and modeling of anti-pad array on power delivery system
机译:
防垫阵列对功率传输系统的影响和建模
作者:
Zhiping Yang
;
Jin Zhao
;
Camerlo S.
;
Jiayuan Fang
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
ball grid arrays;
multichip modules;
chip-on-board packaging;
SPICE;
S-parameters;
equivalent circuits;
circuit simulation;
anti-pad array;
power delivery system;
BGA package;
modeling approach;
simulation approach;
3D field computation;
ground planes;
h;
79.
Laminate package trends for high-speed system interconnects
机译:
高速系统互连的层压封装趋势
作者:
Cases M.
;
de Araujo D.N.
;
Pham N.
;
Blackshear E.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
flip-chip devices;
chip-on-board packaging;
laminates;
interconnections;
high-speed system interconnects;
packaging solutions;
laminate package trends;
substrate design;
high-speed signaling;
design tradeoffs;
flip chip laminate;
organic laminate;
80.
Notes on polynomial selection for piecewise polynomial model order reduction nonlinear systems
机译:
关于分段多项式模型降阶的多项式选择的注意事项非线性系统
作者:
Balk I.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
polynomials;
nonlinear network analysis;
piecewise polynomial techniques;
reduced order systems;
convergence of numerical methods;
Hermite polynomial expansion;
polynomial selection;
piecewise polynomial model order reduction;
microelectronics system sim;
81.
On the behavioral modeling of integrated circuit output buffers
机译:
关于集成电路输出缓冲器的行为建模
作者:
Stievano I.S.
;
Canavero F.G.
;
Maio I.A.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
buffer circuits;
driver circuits;
CMOS digital integrated circuits;
equivalent circuits;
integrated circuit modelling;
SPICE;
behavioral macromodels;
single ended buffers;
CMOS integrated circuits;
integrated circuit output buffers;
constitutive relation;
82.
Significant reduction of power/ground inductive impedance and simultaneous switching noise by using embedded film capacitor
机译:
通过使用嵌入式薄膜电容器,可显着降低电源/地感应阻抗并同时降低开关噪声
作者:
Hyungsoo Kim
;
Youchul Jeong
;
Jongbae Park
;
SeokKyu-Lee
;
JongKuk-Hong
;
Youngsoo Hong
;
Joungho Kim
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
power supply circuits;
chip-on-board packaging;
integrated circuit noise;
printed circuits;
frequency-domain analysis;
time-domain analysis;
thin film capacitors;
inductance;
electric impedance;
power-ground inductive impedance;
simultaneous switching no;
83.
Transmitter and channel equalization for high-speed server interconnects
机译:
高速服务器互连的发射器和通道均衡
作者:
de Araujo D.N.
;
Diepenbrock J.
;
Cases M.
;
Pham N.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
equalisers;
skin effect;
radio transmitters;
high-speed server interconnects;
channel equalization;
interface designs;
differential serial links;
transmitter equalization;
discrete equalization;
distributed cable equalization;
two-tap FIR driver precompe;
84.
Understanding common-mode noise on wide data-buses
机译:
了解宽数据总线上的共模噪声
作者:
Deutsch A.
;
Smith H.H.
;
Kopcsay G.V.
;
Krauter B.L.
;
Surovic C.W.
;
Elfadel A.
;
Widiger D.J.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
system buses;
integrated circuit interconnections;
crosstalk;
circuit simulation;
integrated circuit noise;
microprocessor chips;
frequency-dependent losses;
reference return path;
on-chip data buses;
crosstalk interaction;
common-mode noise;
on-chip glo;
85.
When are substrate effects important for on-chip interconnects?
机译:
什么时候基板效应对片上互连很重要?
作者:
Ktata M.F.
;
Grabinski H.
;
Gaus G.
;
Fischer H.
会议名称:
《Electrical Performance of Electronic Packaging, 2003》
|
2003年
关键词:
integrated circuit interconnections;
finite element analysis;
S-parameters;
CMOS integrated circuits;
transmission line theory;
grounded substrates;
floating substrates;
on-chip interconnections;
frequency dependency;
line parameters;
inductance per unit;
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