机译:适用于微电子和光电应用的Au-Sn倒装芯片焊料凸点
School of Advanced Materials Science and Engineering Sungkyunkwan University 300 Cheoncheon-dong Jangan-gu Suwon Gyeonggi-do 440-746 South Korea;
School of Advanced Materials Science and Engineering Sungkyunkwan University 300 Cheoncheon-dong Jangan-gu Suwon Gyeonggi-do 440-746 South Korea;
School of Advanced Materials Science and Engineering Sungkyunkwan University 300 Cheoncheon-dong Jangan-gu Suwon Gyeonggi-do 440-746 South Korea;
School of Advanced Materials Science and Engineering Sungkyunkwan University 300 Cheoncheon-dong Jangan-gu Suwon Gyeonggi-do 440-746 South Korea;
机译:用于微电子和光电应用的Au-Sn倒装芯片焊料凸点
机译:低温倒装芯片应用中铟焊球的光电和微波传输特性
机译:凸块冶金条件下含Ti / Ni(V)/ Cu的Sn-37Pb和Sn-3Ag-1.5Cu / Sn-3Ag-0.5Cu复合倒装芯片凸块的电迁移
机译:在Au / Ni / Cu / Cu或Cu金属的基材垫上粘合在96.5sn-3ag-0.5cu倒装芯片焊盘上的电迁移
机译:使用数字图像关联和光学显微镜对倒装芯片焊料凸点进行应变测量
机译:无铅焊料合金:(Au + Sb + Sn)和(Au + Sb)系统的热力学性质
机译:用于微电子和光电子的au-sN倒装芯片焊料凸点 应用