A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate

摘要

A new analytic model is presented(based on the induced current density distribution inside silicon substrate)to calculate the frequency dependent distributed series inductance and associated series resistance per unit of a microstrip interconnect on lossy silicon substrate. the validity of the proposed model has been checked by a comparison with a full-wave spectral domain approach and equivalent-circuit modeling procedure. It is found that the difference between the closed-form solution and the EM simulation results was less than 4/100 over a wide range of substrate resistivities and frequencies.