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CAD-Oriented equivalent-circuit modeling of on-chip interconnects on lossy silicon substrate

机译：有损硅衬底上片上互连的CaD定向等效电路建模

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Ji Zheng; Yeon-chang Hahm; Student Member; Vijai K. Tripathi; Andreas Weisshaar; Senior Member;
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1. CAD-oriented equivalent-circuit modeling of on-chip interconnects on lossy silicon substrate [J] . Ji Zheng, Yeon-Chang Hahm IEEE Transactions on Microwave Theory and Techniques . 2000,第9期

机译：有损硅基板上片上互连的面向CAD的等效电路建模
2. CAD-ORIENTED MODEL FOR FREQUENCY-DEPENDENT IMPEDANCE MATRIX OF VLSI INTERCONNECTS ON LOSSY SILICON SUBSTRATE [J] . HASAN YMERI, BART NAUWELAERS, KAREN MAEX, Revue Roumaine des Sciences Techniques. Mecanique Appliquee . 2001,第4期

机译：硅基衬底上VLSI互连的频率相关阻抗矩阵的CAD导向模型
3. A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate [J] . Hasan Ymeri, Bart Nauwelaers, Karen Maex Microprocessors and microsystems . 2002,第1期

机译：面向CAD的硅衬底上微带片上互连的频率相关串联电阻和电感的分析模型
4. Equivalent circuit modeling of single and coupled on-chip interconnects on lossy silicon substrate [C] . Zheng, J., Hahm, Electrical Performance of Electronic Packaging, 1999 . 1999

机译：有损硅基板上单片和耦合片上互连的等效电路建模
5. Silicon and Epitaxially Grown III-V-On-Silicon Photonic Devices for On-Chip Optical Interconnects. [D] . Feng, Shaoqi. 2013

机译：用于片上光学互连的硅和外延生长的III-V-硅上光子器件。
6. On-chip wireless silicon photonics: from reconfigurable interconnects to lab-on-chip devices [O] . Carlos García-Meca, Sergio Lechago, Antoine Brimont, 2017

机译：片上无线硅光子学：从可重新配置的互连到片上实验室设备
7. Wideband Lumped Element Model for On-Chip Interconnects on Lossy Silicon Substrate [O] . Sheng Sun, Rakesh Kumar, Subhash C. Rustagi, 2008

机译：有耗硅衬底上片上互连的宽带集总元模型

CAD-Oriented equivalent-circuit modeling of on-chip interconnects on lossy silicon substrate

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