Improving thermal performance of miniature heat pipe for notebook PC cooling

摘要

A miniature heat pipe (MHP) with woven wire wick was used for cooling a notebook PC. The cross-sectional area of the pipe is reduced by about 30/100 of the original, when the diameter of the MHP is pressed from 4 to 2 mm for packaging in a notebook PC. In the present study, a test of the MHP has been performed in order to review the thermal performance by varying pressed thickness, total length of MHP, wall thickness, heat flux and inclination angle. New wick types were considered for overcoming low heat transfer limits, which occur when the MHP is pressed to a thin plate.