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Czochralski-grown nitrogen-doped silicon: Electrical properties of MOS structures; A positron annihilation study

机译:直拉生长的氮掺杂硅:MOS结构的电性能;正电子an灭研究

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Czochralski-grown nitrogen-doped (NCZ) silicon was studied using different methods. Measurements of interface traps density, effective generation lifetime and effective surface generation velocity were performed on selected Metal-Oxide-Semiconductor (MOS) structures. Application of the positron annihilation technique (PAS)—pulsed low energy positron system (PLEPS)—was focused on the detection of nitrogen-related defects in NCZ silicon in the near surface region. PAS—PLEPS technique gave relevant results on p-type NCZ silicon. Low sensitivity in the application to n-type NCZ silicon discriminates the PAS—PLEPS technique and should be alternated by other experimental technique. On the other hand, more pertinent measurement of generation lifetime was performed on MOS structures with n-type Si. Although the generation lifetime decreases in NCZ silicon, considerable lateral homogenization of the relaxation time was observed on the wafer.
机译:使用不同的方法研究了直拉生长的氮掺杂(NCZ)硅。在选定的金属氧化物半导体(MOS)结构上进行了界面陷阱密度,有效生成寿命和有效表面生成速度的测量。正电子an没技术(PAS)的应用-脉冲低能正电子系统(PLEPS)-专注于检测近表面区域NCZ硅中与氮有关的缺陷。 PAS-PLEPS技术在p型NCZ硅上给出了相关结果。在n型NCZ硅应用中的低灵敏度可区分PAS-PLEPS技术,应与其他实验技术相替代。另一方面,对具有n型Si的MOS结构进行了更相关的发电寿命的测量。尽管NCZ硅的生成寿命降低,但是在晶片上观察到弛豫时间的横向均质性。

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