机译:使用非导电性糊剂的热超声倒装芯片键合工艺提高柔性基板上芯片的键合强度
Department of Occupational Safety and Health, Chung Shan Medical University, No. 110, Sec. 1, Chien-Kuo N. Road, Taichung 402, Taiwan, ROC Department of Medical Research, Chung Shan Medical University Hospital, No. 110, Sec. 1, Chien-Kuo N. Road, Taichung 402, Taiwan, ROC;
Department of Mechanical Engineering, National Chung Cheng University, 168 University Road, Minhsiung, Chiayi 621, Taiwan, ROC;
Material and Chemical Research Laboratories, Industrial Technology Research Institute, 195, Sec. 4, Chung Hsing Road, Chutung, Hsinchu, Taiwan, ROC;
Department of Packaging Equipment, Laser Application Center, Industrial Technology Research Institute South Branch, No. 8, Gongyan Road, Liujia, Tainan 734, Taiwan, ROC;
Department of Packaging Equipment, Laser Application Center, Industrial Technology Research Institute South Branch, No. 8, Gongyan Road, Liujia, Tainan 734, Taiwan, ROC;
flex substrates; non-conductive pastes; thermosonic flip-chip bonding process;
机译:使用具有非导电性糊剂的热超声倒装芯片键合工艺来可靠地组装芯片和柔性基板
机译:在通过热超声倒装芯片键合工艺组装的芯片和柔性基板中执行的TCT和HH / HT测试的可靠性
机译:使用热超声倒装芯片键合工艺组装的芯片和柔性基板的HTS和PCT可靠性
机译:非导电性糊剂的热超声倒装芯片键合工艺在柔性基板上键合芯片的可靠性研究
机译:用于热超声倒装芯片键合的技术和压缩模型。
机译:牙髓三抗生素糊剂对牙本质粘合剂与冠状牙本质粘合强度的影响
机译:使用试验元素组芯片用压阻传感器使用倒装芯片粘接工艺引起的芯片底部填埋和非导电膜对芯片残留应力的评价