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Luminous Efficiency of Pd-Doped Ag-Alloy Wire Bonded LED Package after Reliability Tests

机译:可靠性测试后PD掺杂的Ag-Alloy线粘结LED封装的发光效率

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摘要

In this study, binary Ag-alloy wires were doped with different Pd concentrations, and each wire was encapsulated in an LED package. The initial optical characteristics were tested, and reliability was tested with the high temperature storage life (HTSL), high temperature operating life (HTOL) and wet high temperature operating life (WHTOL). The luminous efficiency of the Ag-alloy wire LED package was about 2% higher than that of the Au wire package, but the addition of 6% Pd to the Ag-alloy wire decreased the luminous efficiency to close to that of the Au-wire LED package. This was due to the high reflectivity of silver in the blue wavelength region, as compared to the low reflectivity of palladium. After 1,000 hours of HTOL and WHTOL, the results showed that the performance of luminous flux maintenance increased with increasing Pd content, indicating that Ag-alloy wires doped with a sufficient amount of Pd can inhibit degradation due to oxidation reaction and thermal and humidity aging. Therefore, binary Ag-Pd alloy wires produced with specific drawing and annealing processes are suitable for mid-power white light LEDs in lighting applications.
机译:在该研究中,二元效合金线掺杂有不同的Pd浓度,并且每个线在LED封装中包封。测试初始光学特性,并通过高温储存寿命(HTSL),高温操作寿命(HTOL)和湿高温操作寿命(WHTOL)测试可靠性。 Ag-Alloy线LED封装的发光效率比Au线包装高约2%,但是加入6%Pd到Ag合金线的发光效率降低,以接近Au-Wire的发光效率LED包装。与钯的低反射率相比,这是由于蓝波长区域中的银中的高反射率。在1,000小时的HTOL和WHTOL之后,结果表明,发光通量维持的性能随着Pd含量的增加而增加,表明掺杂有足够量的Pd掺杂的Ag-合金线可以抑制由于氧化反应和热和湿度老化引起的降解。因此,用特定拉伸和退火工艺生产的二元AG-PD合金电线适用于照明应用中的中型白光LED。

著录项

  • 来源
    《Materials science forum》 |2019年第2019期|221-230|共10页
  • 作者

    Jui-Hung Yuan; Tung-Han Chuang;

  • 作者单位

    Institute of Materials Science and Engineering National Taiwan University No.1 Roosevelt Rd. Sec.4 Taipei 106 Taiwan Fujian Lightning Optoelectronic Co. Ltd. Optoelectronic Industry Park Hutou town Anxi County Quanzhou Fujian;

    Institute of Materials Science and Engineering National Taiwan University No.1 Roosevelt Rd. Sec.4 Taipei 106 Taiwan;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Ag-alloy bonding wire; Reliability; LED package; Encapsulation;

    机译:Ag-Alloy键合线;可靠性;LED包装;封装;

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