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Material selection methodology for gate dielectric material in metal-oxide-semiconductor devices

机译:金属氧化物半导体器件中栅极介电材料的材料选择方法

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摘要

Due to the continuous scaling of metal-oxide-semiconductor (MOS) devices, SiO_2 can no longer be used as a gate dielectric, so it has to be replaced by some suitable high-κ dielectrics. As there are variety of high-κ dielectrics available to designer, so there is a need for a proper technique to select the best possible material. In this paper, we present a materials selection based on the Ashby's methodology to optimise the choice of gate dielectric material in MOS devices. In this work, performance indices and material indices have been developed for gate material in MOS devices and thereafter material selection chart is plotted. The selection chart shows that La_2O_3 is the most suitable materials followed by HfO_2 and ZrO_2 for being used as gate dielectric in MOS devices.
机译:由于金属氧化物半导体(MOS)器件的不断缩小,SiO_2不再可用作栅极电介质,因此必须用一些合适的高k电介质代替。由于设计人员可以使用多种高κ电介质,因此需要一种适当的技术来选择最佳的材料。在本文中,我们介绍了基于Ashby方法的材料选择,以优化MOS器件中栅极电介质材料的选择。在这项工作中,已经为MOS器件中的栅极材料开发了性能指标和材料指标,然后绘制了材料选择表。选择图表明,La_2O_3是最合适的材料,其次是HfO_2和ZrO_2,可用作MOS器件中的栅极电介质。

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  • 来源
    《Materials & design》 |2012年第3期|p.696-700|共5页
  • 作者

    B.N. Aditya; Navneet Gupta;

  • 作者单位

    Department of Electrical and Electronics Engineering, Birla Institute of Technology and Science, Pilani, Rajasthan, India;

    Department of Electrical and Electronics Engineering, Birla Institute of Technology and Science, Pilani, Rajasthan, India;

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