Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path

摘要

A new concept of microelectromechanical system based thermoelectric power generator (TPG) with unique heat dissipation path is investigated in this study. By using solder based wafer bonding technology, the authors can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 μW/cm~2 for temperature difference of about 6 ℃ between two ends of thermocouple junctions. It shows that the proposed device concept is an effective and low cost approach to enhance the output voltage.