SIZE VARIABLE TYPE SEMICONDUCTOR CHIP WHICH INCLUDES EQUIVALENT HEAT DISSIPATION PATHS, A WAFER INCLUDING THE SAME, AND A SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A size variable type semiconductor chip, a wafer including the same, and a semiconductor package using the same are provided to cut one of multiple scribe line parts arranged in a cut region, thereby selectively varying the size of the semiconductor chip.;CONSTITUTION: A wafer body(110) comprises a plurality of semiconductor chip regions(CA) and cut regions(DA). The cut region comprises a plurality of scribe line parts(SL) and a plurality of active parts. A circuit layer(120) is arranged on each semiconductor chip region of the wafer body. The circuit layer comprises a data storage part, a data processing part, and a bonding pad. An additional device is arranged in the active part of each cut region separated from the circuit layer.;COPYRIGHT KIPO 2012