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首页> 外文期刊>Journal of Vacuum Science & Technology. B >Edge transistor elimination in oxide trench isolated N-channel metal-oxide-semiconductor field effect transistors
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Edge transistor elimination in oxide trench isolated N-channel metal-oxide-semiconductor field effect transistors

机译:氧化物沟槽隔离N沟道金属氧化物半导体场效应晶体管中的边缘晶体管消除

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摘要

Bulk N-channel metal-oxide-semiconductor field effect transistors (MOSFETs) can suffer from parasitic edge transistor effects, unless several extra processing and masking steps are used. These edge devices increase the off-state current and degrade subthreshold slope for the N-MOSFETs. Parasitic edge transistors in oxide trench isolated N-MOSFETs, formed using selective epitaxial Growth of silicon, were caused by the boron ou-diffusion during high temperature process steps.
机译:除非使用了几个额外的处理和掩蔽步骤,否则块状N沟道金属氧化物半导体场效应晶体管(MOSFET)可能会受到寄生边缘晶体管的影响。这些边缘器件增加了N-MOSFET的截止状态电流并降低了亚阈值斜率。使用硅的选择性外延生长形成的氧化物沟槽隔离N-MOSFET中的寄生边缘晶体管是由硼在高温工艺步骤中的扩散引起的。

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