The effects of a third element, i.e., Zn in the range of 0.5-2.5 wt.%, on structure and properties of the binary Sn-Ag eutectic lead-free solder alloy were investigated. To identify the structure of the resulting alloys, X-ray diffraction analysis has been carried out. Resistivity, contact angles, Vickers microhardness and Young's modulus have been measured. The results showed that all Zn contents were restricted in formation of Ag-Zn compound indicated by X-ray diffraction peaks, which increased continuously in the number and intensity as Zn content increased. Adding Zn up to 1.5 wt.% improved the wetting and mechanical properties. Above that, wetting angle increased due to the increase in AgZn compound, which may accumulated at the interface between solders and copper-substrate resulting a decrease in the adhesive strength. The alloy of composition Sn-3.5Ag-1.5Zn has the most improved properties between the others.
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