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Effect of Magnesium Addition on Microstructure and Mechanical Properties of Lead-Free Zinc-Silver Solder Alloys

机译:镁的添加对无铅锌银焊料合金组织和力学性能的影响

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Replacing the lead (Pb)-containing solders with the Pb-free solders in electronic products has been a global trend due to environmental and human health concerns for Pb toxicity. Many kinds of Pb free solder alloys have been proposed to date. Zinc (Zn) based Pb-free solder can be a promising alternative of Sn-Pb solder because of its competitive price and mechanical properties. In this research, Zn based solder alloys were developed by addition of silver (Ag) and magnesium (Mg) through conventional casting method. The changes in tensile strength, microhardness microstructure associated with the addition of relatively high melting point noble metal namely Ag were investigated in this work. Furthermore, the effects Mg addition on these mechanical properties and microstructure of the promising candidate Zn-Ag based alloys were extensively reported. Chemical composition of the alloys was confirmed by XRF analysis. A significant change in microstructure, microhardness and strength were found with the change of Ag content. A more interesting point is that the addition of Mg with Zn-Ag alloy increases the microhardness and strength to a large extent as well as ternary eutectic phases in the microstructures.
机译:由于环境和人类健康对Pb毒性的关注,用电子产品中的无铅焊料代替含铅(Pb)焊料已成为全球趋势。迄今为止,已经提出了多种无铅焊料合金。基于锌(Zn)的无铅焊料因其具有竞争力的价格和机械性能而成为有希望的Sn-Pb焊料替代品。在这项研究中,通过传统的铸造方法通过添加银(Ag)和镁(Mg)来开发Zn基焊料合金。在这项工作中,研究了与添加相对较高熔点的贵金属即银相关的拉伸强度,显微硬度显微组织的变化。此外,广泛报道了镁添加对这些有前景的候选锌-银基合金的机械性能和微观结构的影响。通过XRF分析证实了合金的化学组​​成。随着Ag含量的变化,显微组织,显微硬度和强度发生了显着变化。更有趣的一点是,在Zn-Ag合金中添加Mg在很大程度上提高了显微硬度和强度,以及在显微组织中增加了三元共晶相。

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