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Electronic Packaging Interconnect Technology Symposium

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1.Preliminary Study on Deformation and Recrystallization Behavior of Pure Tin for Mitigation of Whisker Growth

机译：纯锡变形及重结晶行为对晶须增长缓解的初步研究
- 作者：Noriyuki Kuwano;Marina binti Lias;Nur Azmah binti Nordin;Youhei Soejima;Ahmad Rafiqan bin Nayan
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Electron microscopy;
- EBSD;
- Deformation;
- Recrystallization;
- Grain boundary;
- Tin whisker;
- Lead-free;
2.Manganese Substituted Iron Titanate Particles with Enhancement Adsorption Capacity for Removal of Remazol Brilliant Blue R Dye

机译：锰取代的铁钛酸盐颗粒，具有增强吸附能力，用于去除雷达唑辉煌的蓝色R染料
- 作者：AZIA WAHIDA Abdul Aziz;KHAIRUL ANUAR Mat Amin;Mohd Hasmizam Razali
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Iron titanate;
- Adsorption;
- Removal;
- Dye;
3.Grain Refinements of Cu_6Sn_5 in Sn-3wtAg-5wtCu High Temperature Solder Alloys

机译：Sn-3wt％Ag-5wt％Cu高温焊合金Cu_6sn_5的晶粒细化
- 作者：XIN Fu Tan;MOHD Arif Anuar Mohd Salleh;STUART McDonald;Kazuhiro Nogita
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Pb-free solder;
- Tin alloy;
- Grain refinement;
- Undercooling;
4.Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy

机译：BI添加对SN-0.7CU焊料合金润湿性和力学性能的影响
- 作者：M. I. I. Ramli;M. S. S. Yusof;M. A. A. Mohd Salleh;R. M. Said;K. Nogita
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Lead-free Solder;
- Bismuth;
- Wettability;
- Intermetallic;
5.Brazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy

机译：使用SN-AG-TI活性焊接合金钎焊蓝宝石/蓝宝石和蓝宝石/铜三明治接头
- 作者：Kuiyuan Feng;Dekui Mu;Xinjiang Liao;Hui Huang;Xipeng Xu
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Sapphire;
- Brazing;
- Sn-Ag-Ti;
- Interfacial reaction;
- Wetting;
- Low temperature;
6.Palladium(II) Picoline Thiourea Complex as Homogenous Catalyst in Heck Cross-Coupling Reaction in the Formation of C=C Bond

机译：钯（II）吡啶硫脲复合物作为均匀催化剂在Heck交叉偶联反应中形成C = C键
- 作者：Wan M. Khairul;Meei Mei;Rafizah Rahamathullah;Siti Kamilah Che Soh;Mustaffa Shamsuddin
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Palladium;
- Thiourea;
- Heck;
- Homogenous catalysis;
7.Evaluation of ICP-OES Method for Heavy Metal and Metalloids Determination in Sterile Dump Material

机译：无菌倾卸材料中重金属和金属化测定的ICP-OES法评价
- 作者：DARYA Ilieva;ANDRIANA Surleva;MANUELA Murariu;GABI Drochioiu;MOHD MUSTAFA Al Bakri Abdullah
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- ICP-OES;
- Sterile dump material;
- Method validation;
- Multielement alanalysis;
8.The Effect of Temperature on Anatase TiO_2 Photoanode for Dye Sensitized Solar Cell

机译：温度对染料敏化太阳能电池锐钛矿TiO_2 PhotoNode的影响
- 作者：NURNAEIMAH Jamalullail;ILI Salwani Mohamad;MOHD Natashah Norizan;NORSURIA Mahmed
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Dye sensitized solar sell;
- TiO_2;
- Anatase;
- Photoanode;
- Annealing temperature;
9.The Formation and Properties of Zeolite-A and Zeolite-X through Geopolymerisation of Metakaolin

机译：沸石-A和沸石-X的形成与性质通过甲状腺素的地区聚合物
- 作者：Subaer;Hamzah Fansuri
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Geopolymers;
- Metakaolin;
- Zaeolit-A;
- Zeolite-X;
10.Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens

机译：SN-Sb和Sn-Ag-Cu-Ni-Ge合金使用微型尺寸标本的拉伸性能的比较
- 作者：Tatsuya Kobayashi;Masaki Yokoi;Kyosuke Kobayashi;Kohei Mitsui;Ikuo Shohji
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Lead-free solder;
- Sn-5Sb;
- Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge;
- Tensile properties;
- Miniature size specimen;
11.Microstructure and Phase Analyses on the Corrosion of SAC305 Solder in NaCl Solution

机译：NaCl溶液SAC305焊料腐蚀的微观结构和相位分析
- 作者：NURWAHIDA Mohd Zaini;Mukridz Md Mohtar;Ahmad Azmin Mohamad;Muhammad Firdaus Mohd Nazeri
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Corrosion;
- Potentiodynamic polarization;
- SAC305;
- Solder;
- Sodium chloride;
12.Effect of Phosphorus and Nickel on Electrochemical Migration of Sn-3Ag-0.7Cu Solder Paste in Simulated Body Fluid

机译：磷和镍对Sn-3Ag-0.7Cu焊膏在模拟体液中电化学迁移的影响
- 作者：OTHMAN Norinsan Kamil;SALLEH Emee Marina;SARVESWARAN C.;F. Che Ani
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Lead free solder;
- Electrochemical migration;
- Corrosion;
- Sn-3Ag-0.7Cu;
- Water drop test;
13.Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder

机译：痕量磷对锡铜镍波焊料渣土形成的影响
- 作者：XUAN Quy Tran;MOHD Arif Anuar Mohd Salleh;STUART D. McDonald;Kazuhiro Nogita
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Ni2SnP;
- Intermetallics;
- Fluidity;
- Dross;
- Wave solder;
- Tin oxides;
14.Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte

机译：SN-ZN-BI无铅焊料在KOH电解质中的腐蚀
- 作者：Ervina Efzan M. N.;Kamaneeya R.
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Solder;
- Corrosion;
- Sn-Bi;
- Wettability;
15.Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution

机译：Al添加对酸性溶液Sn-9Zn焊料腐蚀性能的影响
- 作者：NORDARINA Jumali;MOHD Hafiz Zainol;Ahmad Azmin Mohamad;Muhammad Firdaus Mohd Nazeri
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Corrosion;
- Potentiodynamic Polarization;
- Sn-9Zn;
- Sn-9(5Al-Zn);
- Microstructure;
16.Tensile Properties of Sn-Bi Lead-Free Solder Alloys

机译：SN-BI无铅焊料合金的拉伸性能
- 作者：Akira Yamauchi;Kenta Ida;Masahito Fukuda;Takuma Yamaguchi
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Lead-free solder;
- Sn-Bi-Cu;
- Sn-Bi-Ni;
- Tensile properties;
- Solidification;
17.Corrosion Performance of Sn-9Zn and Sn-0.7Cuin 3.5 NaCI Solution

机译：Sn-9Zn和Sn-0.7cuin 3.5％NaCl溶液的腐蚀性
- 作者：ZARRUL AZWAN Mohd Rasid;MOHD HAFIZ Zainol;MOHD FIRDAUS Omar;MOHD NAZREE Derman;MUHAMMAD FIRDAUS Mohd Nazeri
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Sn-0.7Cu;
- Sn-9Zn;
- Solder;
- Potentiodynamic polarization;
- Corrosion;
18.Effect of Trace Elements on the Liquid Structure of Sn-Cu Alloys Investigated by High Energy X-Ray Diffraction

机译：微量元素对高能X射线衍射研究Sn-Cu合金液体结构的影响
- 作者：DONGDONG Qu;STUART D. McDonald;HIDEYUKI Yasuda;Koji Ohara;Shinji Kohara;Kazuhiro Nogita
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Liquid metals;
- Synchrotron X-ray diffraction;
- Solidification;
19.Diffractografic Analysis of AISI 420 Steel

机译：AISI 420钢的衍射分析
- 作者：Dragos Cristian ACHITEI;Mirabela Georgiana MINCIUNA
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Stainless steel;
- Heat treatments;
- X-ray diffraction;
20.Synthesis, Characterization and Crystal Structure of Coordination Polymers Developed as Anion Receptor

机译：作为阴离子受体开发的配位聚合物的合成，表征和晶体结构
- 作者：KADIR M. A.;SUMBY C. J.
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Coordination polymers;
- Crystal structure;
- Synthesis;
- Cadmium complexes;
- Anion receptor;
21.Formation of Cu_6Sn_5/(Cu, Ni)_6Sn_5 Intermetallic Compounds between Cu_3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding

机译：通过瞬时液体粘合形成Cu_3SN的Sn-Cu / Sn-Cu-Ni粉末合金和熔融Sn之间的Cu_6SN_5 /（Cu，Ni）_6SN_5金属间化合物
- 作者：FLORA Somidin;STUART McDonald;KAZUHIRO Nogita
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Intermetallics;
- Transient Liquid Phase (TLP) bonding;
- Liquid-solid reactions;
- Scanning electron microscopy;
- Microstructure;
22.Effect of Geopolymer Coating on Mild Steel

机译：地质聚合物涂层对低碳钢的影响
- 作者：Farah Farhana Zainal;Muhammad Faiz Fazill;Kamarudin Hussin;Azmi Rahmat;Mohd Mustafa Al Bakri Abdullah;Warid Wazien
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Geopolymer coating;
- Mild steel;
- Open circuit potential;
- Pourbaix diagram;
23.Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface

机译：表面电位分布对SnAGCU焊料/ Cu衬底界面腐蚀行为的影响
- 作者：Omid Mokhtari;Hiroshi Nishikawa
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Surface potential difference;
- Lead-free solder;
- Corrosion;
- Atomic force microscopy;
- Microelectronics packaging;
24.Aloe Vera Liquid Crystal Emulsion and Characterization of its Physical Properties

机译：芦荟液晶乳液和其物理性质的表征
- 作者：TAN Wen Ni;LAILI Che Rose;HAMDAN Suhaimi
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Liquid crystal;
- Aloe Vera;
- Emulsion;
- Particle size;
- Rheology;
- Skin;
25.Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification

机译：SN-0.7CU-0.05NI焊料凝固的同步rotron造影
- 作者：J. W. Xian;M. A. A. Mohd Salleh;G. Zeng;S. A. Belyakov;H. Yasuda;K. Nogita;C. M. Gourlay
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Pb-free soldering;
- Crystal growth;
- Intermetallics;
- Nucleation;
- Eutectic;
- Cu_6Sn_5;
26.Wettability of Sn-Ti Alloys on Poly-Crystalline CVD Diamond Plates

机译：聚结晶CVD金刚石板上Sn-Ti合金的润湿性
- 作者：Xinjiang Liao;Qiqi He;Dekui Mu;Hui Huang;Xipeng Xu
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Wettability;
- Contact angle;
- Poly-crystalline CVD diamond;
- Active Ti;
- Spreading;
27.Synthesis and Characterization of Ag/TiO_2 Thin Film via Sol-Gel Method

机译：溶胶 - 凝胶法的合成与表征Ag / TiO_2薄膜
- 作者：D. S. C. Halin;M. M. A. Abdullah;M. A. A. Mohd Salleh;N. Mahmed;A. N. Mohd Sakeri;K. Abdul Razak
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Ag/TiO_2;
- Thin Film;
- Sol-Gel;
- Porous;
- Anatase;
- Photocatalytic;
28.STEM Analysis of Atom Location in (Cu, Au, Ni)_6Sn_5 Intermetallic Compounds

机译：原子地区的茎分析（Cu，Au，Ni）_6sn_5金属间化合物
- 作者：WENHUI Yang;Tomokazu Yamamoto;Kazuhiro Nogita;Syo Matsumura
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Intermetallic Cu_6Sn_5;
- Atomic structure;
- Scanning transmission electron microscopy;
29.Influence of Bismuth in Sn-Based Lead-Free Solder - A Short Review

机译：铋在SN基无铅焊料中的影响 - 短暂的评论
- 作者：N. R. Abdul Razak;M. A. A. Mohd Salleh;Norainiza Saud;Rita Mohd Said;M. I. I. Ramli
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Bismuth;
- Sn-based Lead-free Solder;
- Melting Temperature;
- Microstructure;
- Intermetallic Compound;
30.The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates

机译：Sn-Ga合金和Au涂层Cu基材的相互作用
- 作者：Shiqian Liu;Dongdong Qu;Stuart McDonald;Kazuhiro Nogita
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Low temperature solder;
- Gallium;
- Intermetallic;
- X-ray fluorescence microanalysis;
31.Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review

机译：Sn Cu Cu Cutictic合金的凝固行为：简短评论
- 作者：R. M. Said;M. A. A. Mohd Salleh;N. Saud;M. I. I. Ramli;A. V. Sandu
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2018年
- Sn Cu peritectic alloys;
- Peritectic reaction;
- Microstructure;
32.Coefficient of thermal expansion (CTE) study in metal matrix composite of CuSiC vs AlSiC

机译：Cusic VS Alsic金属基质复合材料中的热膨胀系数（CTE）研究
- 作者：Mohd N Arif;Mohabattul Z Bukhari;Dermot Brabazon
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
33.Transient liquid phase bonding for so9der-a short review

机译：瞬态液相键合用于SO9DER - 短暂的评论
- 作者：Norainiza Saud;Rita Mohd Said
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
34.Current advancement in electrically conductive polymer composites for electronic interconnect applications: A short review

机译：用于电子互连应用的导电聚合物复合材料的电流前进：简短的回顾
- 作者：Farah Badrul;Khairul Anwar Abdul Halim;Mohd Arif Anuar Mohd Salleh
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
35.The effect of chloride ion diffusion on corrosion activity of kaolin geopolyrner paste in artificial seawater

机译：氯离子扩散对人工海水高岭土地质浆浆腐蚀活性的影响
- 作者：Farah Farhana Zainal;Sahrul Abd Hakim;Yusrina Mat Daud
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
36.Investigation on Passivation Behavior of Sn-0.7Cu Solder in Different Polarizing Conditions

机译：SN-0.7CU焊料在不同偏振条件下钝化行为的研究
- 作者：Wai Kuan Ho;Ahmad Azmin Mohamad;Muhammad Firdaus Mohd Nazeri
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
37.Graphitization damage on seamless steel tube of pressurized closed-loop of steam boiler

机译：蒸汽锅炉加压闭环无缝钢管的石墨化损伤
- 作者：Nar Farhana Hayazi;Shaiful Rizam Shamsudin;Rajaselan Wardan
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
38.Thermal behaviour and microsiructural analysis of Sn-0.7Cu alloy and Sn-0.7Cu soldered on electroiess nickel/immersion gold

机译：SN-0.7CU合金和SN-0.7CU在电器镍/浸渍金中焊接SN-0.7CU合金的热行为和微观探测分析
- 作者：Ai Zing Teoh;Mohd Arif Anuar Mohd Salleh;Dewi Suriyani Che Halin
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
39.The influence of graphite on conductivity, crystallinity and tensile properties of hydroxyethyl cellulose (hec) / graphite composite films

机译：石墨对羟乙基纤维素（HEC）/石墨复合膜的电导率，结晶度和拉伸性能的影响
- 作者：Mohd Pisal Mohd Hanif;Abd. Jalil Jalilah;Farah Badrul
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
40.Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates

机译：Cu-XNI基材上（Cu，Ni）6SN5的生长速率的温度依赖性
- 作者：Xin Fu Tan;Nurul Razliana Abdul Razak;Muhammad Hafiz Husain
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
41.A review of geopo!ymer ceramic as a potential reinforcement material in solder alloys.

机译：Geopo的综述！ymer陶瓷作为焊料合金中的潜在加强材料。
- 作者：Nur Nadiah Izzati Zulkiflii;Mohd Mustafa Al-Bakri Abdullah;Mohd Arif Anuar Mohd Salleh
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
42.Study on polylactic acid/acrylonitrile butadiene styrene composites filled with micro-crystalline cellulose

机译：用微晶纤维素填充聚乳酸/丙烯腈丁二烯苯乙烯复合材料的研究
- 作者：Siti Nursyameza Shaharin;Mohamad Kahar Ab Wahab
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
43.Effects of Gallium addition on the thermal properties and whiskers growth under electrical current stressing

机译：镓添加对电流应力下热性能和晶须生长的影响
- 作者：Noor Zaimah Mohd Mokhtar;Mohd Arif Anuar Mohd Salleh;Aimi Noorliyana Hashim
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
44.Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys

机译：Zn添加对Sn-10Cu合金Cu3Sn形成的影响
- 作者：Syeda U. Mehreen;Kazuhiro Nogita;Stuart McDonald
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
45.Effect of solution concentration and applied voltage on electrospun polyacrylonitrile fibers

机译：溶液浓度和施加电压对电纺聚丙烯腈纤维的影响
- 作者：Sharifah Shahnaz Syed Bakar;Kar Mun Foong;Norzilah Abdul Halif
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
46.Effect of Laser Loop on Surface Morphology of Copper Substrate and Wettability of Solder Joint

机译：激光环对铜基材表面形态的影响及焊点润湿性
- 作者：S. Faqihah Roduan;J. A. Wahab;M. H. Aiman
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
47.Removal of iron in rice husk via oxalic acid leaching process

机译：通过草酸浸出工艺去除稻壳中的铁
- 作者：Faizul Che Pa;Wowg Kok Kein
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
48.Characterization of Electrical Current Stress and Indentation Creep of Carbon Nanotubes-reinforced Low Melting Temperature Sn-58Bi Composites

机译：碳纳米管增强低熔点Sn-58Bi复合材料的电流应力和压痕蠕变的表征
- 作者：Kian Lu Sia;Syed Alif Ilyasak Barakbah;Ho Cheng How
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
49.Influence of NiO to SDC ratio on the properties of Ni-SDC cermet prepared via reduction process

机译：NIO对SDC比率对通过还原过程制备的Ni-Sdc Cermet性能的影响
- 作者：Salmie Suhana Che Abdullah;Siti Sarah Ismail
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
50.Mitigation techniques for crosstalk in ICs

机译：串扰串扰的减缓技术
- 作者：Rifhan Amira Mohd Razif;Siti Marwangi Mohamad Maharum;Azri Husni Hasani
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
51.Experimental measurement for non-spherical bulk materials flow behaviour in rectangular enclosure

机译：矩形外壳中非球形散装材料流动的实验测量
- 作者：Anis Farhanah Mohd Fadzir;Siti Ilyani Rani;Jolius Gimbun
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
52.Thermoplastic Polyurethane (TPU) / Organo-fSuoromica Nanocomposites for Biomedical Applications: In Vitro Fatigue Properties

机译：用于生物医学应用的热塑性聚氨酯（TPU）/有机FSUOROMICA纳米复合材料：体外疲劳性能
- 作者：Azlin Fazlina Osman;Darren James Martin
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
53.Electrochemical migration and corrosion behaviours of SAC305 reinforced by NiO, Fe2O3, TiO2 nanoparticles in NaCl solution

机译：NiO，Fe2O3，TiO2在NaCl溶液中加固SAC305的电化学迁移和腐蚀行为
- 作者：Norinsan Kamil Othman;Fakhrul Rifdi Omar;Fakhrozi Che Ani
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
54.Injection Moulding Recommended Parameters Simulation Analysis of Rice Husk Composite

机译：注射成型推荐参数稻壳复合材料仿真分析
- 作者：Haliza Jaya;Nik Noriman Zulkepli;Mohd Firdaus Omar
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
55.Ffexural Properties of AI/Floral Foam Sandwich Composite Prepared by Hand Lay Up Process

机译：AI /花卉泡沫夹层复合材料的FFEDURATURE PATHED工艺
- 作者：Zainuddin Firuz;Leong Chit Shing;Syed Adam Syed Nuzul Fadzli
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
56.Effect of rare-element (Ga) addition on the microstructure and mechanical properties of Sn-0.7Cu and Sn-0.7Cu-0.05Ni lead-free solder alloys

机译：稀有元素（GA）添加对Sn-0.7Cu和Sn-0.7Cu-0.05Ni无铅焊料合金的微观结构和机械性能的影响
- 作者：Sufian Firdaus Nazri;Mohd Arif Anuar Mohd Salleh
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
57.SVIicrostructural studies of doped PEG Ag/TiO2 thin film

机译：掺杂PEG AG / TiO2薄膜的SVIICrostratural研究
- 作者：Kamrosni Abdul Razak;Dewi Suriyani Che Halin;Azliza Azani
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
58.Synthesis of alumina nanoparticles by sol-gel method and their applications in the removal of copper ions (Cu~(2+)) from the solution

机译：通过溶胶 - 凝胶法合成氧化铝纳米粒子及其在溶液中除去铜离子（Cu〜（2+）中的应用
- 作者：Siti Nur Syakirah Mohamad;Norsuria Mahmed;Dewi Suriyani Che Halin
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
59.Effect of graphene oxide on microstructure and optical properties of TiO2 thin film

机译：石墨烯氧化物对TiO2薄膜微观结构和光学性质的影响
- 作者：Azliza Azani;Dewi Suriyani Che Halm;Kamrosni Abdul Razak
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
60.Effect of crumb rubber type on macroballoons towards physicaS and mechanical properties in syntactic foams

机译：基屑橡胶型对句法泡沫物理和力学性能的影响
- 作者：Zunaida Zakaria;Tiyagu Sathivelu
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
61.Characterization of geopolymer ceramic reinforced Sn-0.7Cu composite solder: Effect of milling time and speed.

机译：地质聚合物陶瓷增强Sn-0.7Cu复合焊料的表征：铣削时间和速度的影响。
- 作者：Marliza Mostapha;Mohd Arif Anuar Mohd Salleh;Mohd Mustafa Al Bakri
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
62.Effects of ultrasonication process on crystallinity and tear strength of thermoplastic starch/cellulose biocomposites

机译：超声处理过程对热塑性淀粉/纤维素生物复合材料结晶和撕裂强度的影响
- 作者：Ismail Ibrahim;Azlin Fazlina Osman;Tan Leong Ping
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
63.The influence of Copper and Bismuth element in Sn-Ag solders and EN1MAG substrate

机译：铜和铋元件在SN-AG焊料和EN1MAG基板的影响
- 作者：Jaidi Zolhafizi;Osman. Saliza Azlina
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
64.Synthesis and charactherization of TiO2 doped SnO2 thin film prepared by sol-gel method

机译：通过溶胶 - 凝胶法制备TiO2掺杂SnO2薄膜的合成和羟基化
- 作者：Dewi Suriyani Che Halin;Kamrosni Abdul Razak;Azliza Azani
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
65.Synthesis of SIC nanowhiskers by microwave heating: effect of size of graphite

机译：微波加热合成SiC Nanowhiskers：石墨尺寸的影响
- 作者：Suhaimi Mat Kahar;Chun Hong Voon;Bee Ying Lim
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
66.Interfacial reactions between different Sn-based lead-free solder alloys and CuNi substrates

机译：不同SN基无铅焊料合金与CUNI基材之间的界面反应
- 作者：Nurul Razliana Abdul Razak;Xin Fu Tan;Stuart D. McDonald
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
67.Effect of Surface Preparation on the Isothermal Oxidation of Fe-33Ni-19Cr Alloy

机译：表面制备对Fe-33Ni-19Cr合金等温氧化的影响
- 作者：N Parimin;Jemahri
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
68.Mechanical properties of Sn based lead free solder under different temperature

机译：不同温度下基于Sn基铅焊料的机械性能
- 作者：Norliza Ismail;Maria Abu Bakar;Azman Jalar
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
69.The appearance of machining burr as a cracking failure on twistlock pin

机译：加工毛刺作为扭锁销的破裂故障的外观
- 作者：Wahid Mohamad Fitri Mohd;Shamsudin Saiful Rizam;Sanusi Mohamad Syazwan
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
70.Corrosion Assessment of Sn-0.7Cu Lead-Free Solder in 1 M Hydrochloric Acid

机译：SN-0.7CU无铅焊料在1M盐酸中的腐蚀评估
- 作者：Tan Xing Cong;Ahmad Azmin Mohamad;Muhammad Firdaus Mohd Nazeri
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
71.Properties of eco-friendly composites: palm kernel shell treated with sodium bicarbonate filled recycled high-density polyethylene.

机译：环保复合材料的性质：用碳酸氢钠填充再生的高密度聚乙烯处理棕榈仁壳。
- 作者：Nadiatul Husna;Bee Ying Lim;Chun Hong Voon
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
72.Influence of kaolin geopoSymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder

机译：高岭土地质孔陶瓷添加到Sn-3.0Ag-0.5Cu（SAC305）无铅焊料的润湿性和电性能的影响
- 作者：Nur Syahirah Mohamad Zaimi;Mohd Arif Anuar Mohd Salleh;Mohd Mustafa Al Bakri Abdullah
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
73.Suitable materials selection that act as a retardant agent against microwave radiation and electronics packaging to human life

机译：合适的材料选择，其作为一种针对微波辐射和电子包装到人类生命的压延剂
- 作者：Ahmed I Mohammed;Mohabattul Z Bukhari
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
74.Tin (Sn) whisker growth from electroplated Sn finished

机译：电镀Sn的晶须生长完成
- 作者：Aimi Noorliyana Hashim;Mohd Arif Anuar Mohd Salleh;Noor Zaimah Mohd Mokhtar
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
75.The effect of Aluminium addition on the microstructure of lead-free solder alloys: A short review

机译：铝加入对无铅焊料合金微观结构的影响：简要审查
- 作者：Chi Ying Tan;Mohd Arif Anuar Mohd Salleh
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
76.Influence of filler content and mixing time on the properties and morphology of kenaf/polyurethane foam composites

机译：填料含量和混合时间对kEnaf /聚氨酯泡沫复合材料性能和形态的影响
- 作者：Nur Suhaili Mohd Soberi;A. R Rozyanty;Firuz Zainuddin
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
77.Effect of surface finish on the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu solder

机译：表面光洁度对SN-3.0AG-0.5CU焊料润湿性和电阻率的影响
- 作者：Siti Farahnabilah Muhd Amli;Mohd Arif Anuar Mohd Salleh;Rita. Mohd Said
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
78.Effect of different ratio of geopolyrner paste based fly ash-metakao!in on compressive strength and water absorption

机译：基于鹅料浆料的粉煤灰 - Metakao的不同比率的影响！在抗压强度和吸水中
- 作者：Nor Shida Dalila Mohd Azhar;Farah Farhana Zainal;Mohd Mustafa Al Bakri Abdullah
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
79.A review of iron nitride based thin films development

机译：基于氮化物的薄膜发育述评
- 作者：Nur Izzati Muhammad Nadzri;Dayang Mas Shufina Ibrahim;Saphuang Sompon
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
80.Physical properties of Sn-3.0Ag-0.5Cu lead-free solder with the additional of SiC particles

机译：SN-3.0AG-0.5CU无铅焊料的物理性质，具有额外的SiC颗粒
- 作者：Zawawi Mahim;Mohd Arif Anuar Mohd Salleh;Norainiza Saud
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
81.Post-Corrosion Mechanical Analysis of Sn-Zn Alloys: A Short Review

机译：SN-ZN合金的腐蚀后力学分析：简短的评论
- 作者：Muhammad Firdaus Mohd Nazeri;Mohamad Najmi Masri;Ahmad Azmin Mohamad
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
82.Preliminary study of zero charge corrosion protection on steel plate embedded in geopolymer paste

机译：覆盖在地缘聚合物浆料中钢板零充电腐蚀保护的初步研究
- 作者：Siti Aisyah Razak;Farah Farhana Zainal;Shaiful Rizam Shamsudin
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
83.Investigation of Isothermal Oxidation on Heat-treated Fe-40Ni-24Cr Alloy at 950°C

机译：950℃的热处理Fe-40Ni-24Cr合金对等温氧化的研究
- 作者：Noraziana Parimin;Singh
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
84.Oxide scale growth on Fe-40Ni-24Cr alloy at high temperature oxidation

机译：高温氧化下Fe-40Ni-24Cr合金的氧化物尺度生长
- 作者：Noraziana Parimin;Esah Hamzah
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
85.Magnetic properties of TPU/NR blends: low loading NiZn and LNR added

机译：TPU / NR混合物的磁性特性：添加低负荷NiZn和LNR
- 作者：Nor Azwin Ahad;Sahrim Hj Ahmad
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
86.Enhanced thermal and smicrostructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition

机译：SN-1.0AG-0.7CU基于无铅焊料的增强的热和微型结构性能具有钛氧化钛添加
- 作者：Rita Mohd Said;Norainiza Saud;Norhayanti Mohd Nasir
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
87.Recovery of tin from copper dross by acid leaching

机译：通过酸浸出从铜渣中恢复锡
- 作者：Nurul Ain Jabit;Suhaina Ismail;Muhammad Alif Noor Azhar
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
88.Decolorization of reactive red 2 dye by using pva-polyaniline immobilized system

机译：使用PVA-聚酰氯固定化系统脱色反应性红2染料
- 作者：Mohd Fairul Sharin Abdul Razak;Mohd Nazry Salleh;Azliza Azani
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
89.Preparation and characterization of micro-crystalline cellulose / chitosan films

机译：微晶纤维素/壳聚糖薄膜的制备与表征
- 作者：Song Cheah Chie;Mohamad Kahar Ab Wahab
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
90.Effect of zero charge corrosion protection (ZCCP) on the carbon steel surface in 3.5 NaCI solution

机译：3.5NaCl溶液中碳钢表面的零电荷腐蚀防护（ZCCP）效应
- 作者：Shaiful Rizam Shamsudin;Zin Wen Sim;Rajaselan Wardan
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
91.Influence of cooling conditions on the interfaciaS Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow

机译：回流焊时冷却条件对Sn-37Pb/Cu焊点中Cu6Sn5金属间化合物界面的影响
- 作者：Flora Somidin;Stuart McDonald;Tetsuya Akaiwa
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年
92.Morphology and biodegradability of macro- crystalline cellulose / chitosan films

机译：大结晶纤维素/壳聚糖膜的形态和生物降解性
- 作者：Song Cheah Chie;Mohamad Kahar Ab Wahab
- 会议名称：《Electronic Packaging Interconnect Technology Symposium》 | 2020年