机译:银纳米线填充导电胶的综合研究
Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute, Zhongshan 528402, China;
State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology, Cheng Du 610054, China;
State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology, Cheng Du 610054, China;
Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute, Zhongshan 528402, China;
Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute, Zhongshan 528402, China;
Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute, Zhongshan 528402, China;
State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology, Cheng Du 610054, China;
机译:银纳米线-银纳米粒子-石墨烯纳米片复合材料的水热法制备,可提高导电胶的导电性能
机译:银纳米线填充导电胶的新见解
机译:表面改性银纳米线填充的导电胶的烧结行为
机译:银(Ag)纳米粒子填充环氧复合材料在电子包装中施加导电粘合剂(ECAS)的电性能研究
机译:导电胶的基础和应用研究。
机译:银纳米线-银纳米粒子-石墨烯纳米片复合材料的水热法制备可提高导电胶的导电性能
机译:水银制备银纳米线 - 银纳米粒子 - 石墨烯纳米片复合材料增强导电胶粘剂的导电性能
机译:非镜面反射镀银聚四氟乙烯和填充胶粘剂的评价