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A comprehensive study of silver nanowires filled electrically conductive adhesives

机译:银纳米线填充导电胶的综合研究

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摘要

As one of the most important conductive materials, silver nanowires have recently attracted a lot of attention for potential applications such as electrically conductive adhesives, transparent electrodes, and conductive ink. In this paper, silver nanowires with a diameter of 200-570 nm and a length of 20-100 μm were synthesized by a polyol process. The electrically conductive adhesives (ECAs) composed of an epoxy-based binder containing silver nanowire were prepared and the curing behaviors and electrical properties of ECAs were investigated. The in situ monitoring of the variation in electrical resistance of the ECAs explore that silver nanowires impact on the curing behavior of the ECAs. The resistance of the ECAs filled with 40 wt% silver nanowires reaches to 0.59 Ω heated to 11 min from the room temperature to 164 ℃. Silver nanowires significantly improve the electrical conductivity of the ECAs, and the resistivities of the ECAs filled with 35 and 40 wt% silver nanowires is 9.48 × 10~(-4) and 1.42 × 10~4 Ω cm after cured at 168 ℃, respectively. The reasons for the effects of silver nanowires on the curing behavior and the electrical properties were also discussed in terms of the morphology and higher activity of silver nanowires.
机译:作为最重要的导电材料之一,银纳米线最近在诸如导电胶,透明电极和导电油墨等潜在应用中引起了很多关注。本文通过多元醇法合成了直径为200-570 nm,长度为20-100μm的银纳米线。制备了由含银纳米线的基于环氧的粘合剂组成的导电胶(ECA),并研究了ECA的固化行为和电性能。 ECA电阻变化的原位监测发现,银纳米线会影响ECA的固化行为。从室温到164℃加热11分钟,填充有40 wt%银纳米线的ECA的电阻达到0.59Ω。银纳米线显着提高了ECA的导电性,在168℃固化后,填充有35和40 wt%的银纳米线的ECA的电阻率分别为9.48×10〜(-4)和1.42×10〜4Ωcm。 。还就银纳米线的形态和较高的活性讨论了银纳米线对固化行为和电性能的影响的原因。

著录项

  • 来源
    《Journal of materials science》 |2015年第10期|7927-7935|共9页
  • 作者单位

    Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute, Zhongshan 528402, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology, Cheng Du 610054, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology, Cheng Du 610054, China;

    Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute, Zhongshan 528402, China;

    Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute, Zhongshan 528402, China;

    Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute, Zhongshan 528402, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology, Cheng Du 610054, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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